Inventor
TANKONGCHUMRUSKUL KIANGKAI
AU19 patents
⚠️ This page may combine multiple inventors who share the name “TANKONGCHUMRUSKUL KIANGKAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILVERBROOK RES PTY LTD
14 patentsUS7824013B2Nov 2, 2010
Integrated circuit support for low profile wire bond
SILVERBROOK RES PTY LTD23 citations92
US7988033B2Aug 2, 2011
Method of reducing wire bond profile height in integrated circuits mounted to circuit boards
SILVERBROOK RES PTY LTD11 citations84
US7946465B2May 24, 2011
Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards
SILVERBROOK RES PTY LTD11 citations84
US7875504B2Jan 25, 2011
Method of adhering wire bond loops to reduce loop height
SILVERBROOK RES PTY LTD8 citations84
US7802715B2Sep 28, 2010
Method of wire bonding an integrated circuit die and a printed circuit board
SILVERBROOK RES PTY LTD8 citations84
US7659141B2Feb 9, 2010
Wire bond encapsulant application control
SILVERBROOK RES PTY LTD12 citations84
US8025204B2Sep 27, 2011
Method of wire bond encapsulation profiling
SILVERBROOK RES PTY LTD2 citations62
US7741720B2Jun 22, 2010
Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards
SILVERBROOK RES PTY LTD3 citations62
US7669751B2Mar 2, 2010
Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards
SILVERBROOK RES PTY LTD2 citations62
US7915091B2Mar 29, 2011
Method of controlling satellite drops from an encapsulant jetter
SILVERBROOK RES PTY LTD4 citations58
US8039974B2Oct 18, 2011
Assembly of electronic components
SILVERBROOK RES PTY LTD1 citations52
US7803659B2Sep 28, 2010
Method of encapsulating wire bonds
SILVERBROOK RES PTY LTD0 citations52
US7618842B2Nov 17, 2009
Method of applying encapsulant to wire bonds
SILVERBROOK RES PTY LTD1 citations52
US8017450B2Sep 13, 2011
Method of forming assymetrical encapsulant bead
SILVERBROOK RES PTY LTD0 citations48