Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards

Abstract

An electronic device that has an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors corresponding to each of the contact pads respectively, wire bonds electrically connecting each of the contact pads to the corresponding conductors and, an adhesive surface positioned between the contacts pads and the corresponding conductors. The wire bonds are secured to the adhesive surface to hold them in a low profile configuration.

1. An electronic device comprising:
 a supporting structure; 
 an integrated circuit die with a plurality of contacts pads; 
 a printed circuit board with a plurality of conductors corresponding to each of the contact pads respectively, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other; 
 wire bonds electrically connecting each of the contact pads to the corresponding conductors; and, 
 an adhesive surface positioned between the contacts pads and the corresponding conductors; wherein, 
 the wire bonds are secured to the adhesive surface and the adhesive surface is provided by a portion of the die attach film. 
 
     
     
       2. An electronic device according to  claim 1  wherein the adhesive surface is one side of a double-sided adhesive tape. 
     
     
       3. An electronic device according to  claim 1  wherein the PCB is a flexible PCB and the supporting structure is a liquid crystal polymer (LCP) molding. 
     
     
       4. An electronic device according to  claim 1  wherein the wire bonds are formed from lengths of wire with a gauge between 15 microns and 75 microns. 
     
     
       5. An electronic device according to  claim 4  wherein the gauge is about 25 microns. 
     
     
       6. An electronic device according to  claim 4  wherein the wire bonds attach to respective contact pads on the IC die and the wire bonds do not extend more than 150 microns above the contact pads of the IC die. 
     
     
       7. An electronic device according to  claim 6  wherein the line of wire bonds does not extend more than 50 microns above the contact pads of the IC die. 
     
     
       8. An electronic device according to  claim 1  wherein the contact pads are spaced from the corresponding conductors on the PCB by more than 1 mm. 
     
     
       9. An electronic device according to  claim 8  wherein the contact pads are between 2 mm and 3 mm from the corresponding conductors on the PCB. 
     
     
       10. An electronic device according to  claim 1  wherein the PCB is a flexible PCB mounted to a support structure together with the die such that the conductors are adjacent the contact pads on the die. 
     
     
       11. An electronic device according to  claim 10  wherein the support structure has a chip mounting area for supporting the die, the die having a back surface in contact with the chip mounting area and an active surface opposing the back surface, the active surface having the contact pads, and the chip mounting area being raised relative to the remainder of the support structure such that the contact pads are raised relative to the conductors. 
     
     
       12. An electronic device according to  claim 4  wherein the wire bonds is formed using aluminium wire. 
     
     
       13. An electronic device according to  claim 10  wherein the active surface has functional elements spaced less than 260 microns from the contacts pads of the die. 
     
     
       14. An electronic device according to  claim 13  wherein the die is an inkjet printhead IC and the functional elements are nozzles through which ink is ejected. 
     
     
       15. An electronic device according to  claim 14  wherein the printhead IC is configured to be mounted in a printer such that during use the nozzles are less than 100 microns from the paper path.