Inventor

CHUNG-LONG-SHAN LAVAL

AU17 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG-LONG-SHAN LAVAL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG-LONG-SHAN LAVAL

SILVERBROOK RES PTY LTD

Integrated circuit support for low profile wire bond

Method of reducing wire bond profile height in integrated circuits mounted to circuit boards

Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards

Method of adhering wire bond loops to reduce loop height

Method of wire bonding an integrated circuit die and a printed circuit board

Wire bond encapsulant application control

Method of wire bond encapsulation profiling

Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards

Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards

Printhead with exterior surface profiled for wiping maintenance station

Assembly of electronic components

Method of encapsulating wire bonds

Method of applying encapsulant to wire bonds

KRONE GMBH

Multi wire insulation displacement contact and a method of making multi wire terminations

WILLIAMS SUSAN

Electronic component with wire bonds in low modulus fill encapsulant

CHUNG-LONG-SHAN LAVAL

Wire bond encapsulant control method

KRONE GBMH

Z-shaped insulation displacement contact