Inventor

WOOD ALAN G

US389 patents

Patents

50 patents

US7659612B2Feb 9, 2010

Semiconductor components having encapsulated through wire interconnects (TWI)

MICRON TECHNOLOGY INC75 citations99

US7498675B2Mar 3, 2009

Semiconductor component having plate, stacked dice and conductive vias

MICRON TECHNOLOGY INC292 citations99

US7393770B2Jul 1, 2008

Backside method for fabricating semiconductor components with conductive interconnects

MICRON TECHNOLOGY INC130 citations99

US7307348B2Dec 11, 2007

Semiconductor components having through wire interconnects (TWI)

MICRON TECHNOLOGY INC91 citations99

US7221059B2May 22, 2007

Wafer level semiconductor component having thinned, encapsulated dice and polymer dam

MICRON TECHNOLOGY INC61 citations99

US7060526B2Jun 13, 2006

Wafer level methods for fabricating multi-dice chip scale semiconductor components

MICRON TECHNOLOGY INC96 citations99

US7029949B2Apr 18, 2006

Method for fabricating encapsulated semiconductor components having conductive vias

MICRON TECHNOLOGY INC141 citations99

US6998344B2Feb 14, 2006

Method for fabricating semiconductor components by forming conductive members using solder

MICRON TECHNOLOGY INC101 citations99

US6964915B2Nov 15, 2005

Semiconductor component and interconnect having conductive members and contacts on opposing sides

MICRON TECHNOLOGY INC246 citations99

US6841883B1Jan 11, 2005

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

MICRON TECHNOLOGY INC659 citations99

US6833613B1Dec 21, 2004

Stacked semiconductor package having laser machined contacts

MICRON TECHNOLOGY INC106 citations99

US6828175B2Dec 7, 2004

Semiconductor component with backside contacts and method of fabrication

MICRON TECHNOLOGY INC248 citations99

US6715018B2Mar 30, 2004

Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer

MICRON TECHNOLOGY INC220 citations99

US6634100B2Oct 21, 2003

Interposer and methods for fabricating same

MICRON TECHNOLOGY INC98 citations99

US6620731B1Sep 16, 2003

Method for fabricating semiconductor components and interconnects with contacts on opposing sides

MICRON TECHNOLOGY INC293 citations99

US6614104B2Sep 2, 2003

Stackable semiconductor package having conductive layer and insulating layers

MICRON TECHNOLOGY INC220 citations99

US6529027B1Mar 4, 2003

Interposer and methods for fabricating same

MICRON TECHNOLOGY INC118 citations99

US6501165B1Dec 31, 2002

Stackable semiconductor package having conductive layer and insulating layers and method of fabrication

MICRON TECHNOLOGY INC249 citations99

US6465877B1Oct 15, 2002

Semiconductor package including flex circuit, interconnects and dense array external contacts

MICRON TECHNOLOGY INC166 citations99

US6461881B1Oct 8, 2002

Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures

MICRON TECHNOLOGY INC97 citations99

US6453377B1Sep 17, 2002

Computer including optical interconnect, memory unit, and method of assembling a computer

MICRON TECHNOLOGY INC85 citations99

US6451624B1Sep 17, 2002

Stackable semiconductor package having conductive layer and insulating layers and method of fabrication

MICRON TECHNOLOGY INC220 citations99

US6400172B1Jun 4, 2002

Semiconductor components having lasered machined conductive vias

MICRON TECHNOLOGY INC222 citations99

US6368896B2Apr 9, 2002

Method of wafer level chip scale packaging

MICRON TECHNOLOGY INC267 citations99

US6359456B1Mar 19, 2002

Probe card and test system for semiconductor wafers

MICRON TECHNOLOGY INC149 citations99

US6310484B1Oct 30, 2001

Semiconductor test interconnect with variable flexure contacts

MICRON TECHNOLOGY INC147 citations99

US6294837B1Sep 25, 2001

Semiconductor interconnect having laser machined contacts

MICRON TECHNOLOGY INC336 citations99

US6275052B1Aug 14, 2001

Probe card and testing method for semiconductor wafers

MICRON TECHNOLOGY INC118 citations99

US6235554B1May 22, 2001

Method for fabricating stackable chip scale semiconductor package

MICRON TECHNOLOGY INC647 citations99

US6228687B1May 8, 2001

Wafer-level package and methods of fabricating

MICRON TECHNOLOGY INC355 citations99

US6188232B1Feb 13, 2001

Temporary package, system, and method for testing semiconductor dice and chip scale packages

MICRON TECHNOLOGY INC229 citations99

US6169329B1Jan 2, 2001

Semiconductor devices having interconnections using standardized bonding locations and methods of designing

MICRON TECHNOLOGY INC304 citations99

US6114240ASep 5, 2000

Method for fabricating semiconductor components using focused laser beam

MICRON TECHNOLOGY INC522 citations99

US6107109AAug 22, 2000

Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate

MICRON TECHNOLOGY INC403 citations99

US6097087AAug 1, 2000

Semiconductor package including flex circuit, interconnects and dense array external contacts

MICRON TECHNOLOGY INC539 citations99

US6094058AJul 25, 2000

Temporary semiconductor package having dense array external contacts

MICRON TECHNOLOGY INC173 citations99

US6087845AJul 11, 2000

Universal wafer carrier for wafer level die burn-in

MICRON TECHNOLOGY INC88 citations99

US6060891AMay 9, 2000

Probe card for semiconductor wafers and method and system for testing wafers

MICRON TECHNOLOGY INC218 citations99

US6040702AMar 21, 2000

Carrier and system for testing bumped semiconductor components

MICRON TECHNOLOGY INC151 citations99

US6020624AFeb 1, 2000

Semiconductor package with bi-substrate die

MICRON TECHNOLOGY INC304 citations99

US6020629AFeb 1, 2000

Stacked semiconductor package and method of fabrication

MICRON TECHNOLOGY INC621 citations99

US6016060AJan 18, 2000

Method, apparatus and system for testing bumped semiconductor components

MICRON TECHNOLOGY INC132 citations99

US6013948AJan 11, 2000

Stackable chip scale semiconductor package with mating contacts on opposed surfaces

MICRON TECHNOLOGY INC684 citations99

USRE36469EDec 28, 1999

Packaging for semiconductor logic devices

MICRON TECHNOLOGY INC181 citations99

US5958100ASep 28, 1999

Process of making a glass semiconductor package

MICRON TECHNOLOGY INC184 citations99

US5952840ASep 14, 1999

Apparatus for testing semiconductor wafers

MICRON TECHNOLOGY INC128 citations99

Showing the top 50 of 389 patents by PatentIndex Score.

WOOD ALAN G

Patents

Semiconductor components having encapsulated through wire interconnects (TWI)

Semiconductor component having plate, stacked dice and conductive vias

Backside method for fabricating semiconductor components with conductive interconnects

Semiconductor components having through wire interconnects (TWI)

Wafer level semiconductor component having thinned, encapsulated dice and polymer dam

Wafer level methods for fabricating multi-dice chip scale semiconductor components

Method for fabricating encapsulated semiconductor components having conductive vias

Method for fabricating semiconductor components by forming conductive members using solder

Method of fabricating encapsulated semiconductor components by etching

Hermetic chip in wafer form

Method for fabricating encapsulated semiconductor components

Semiconductor component having backside pin contacts

Semiconductor component and interconnect having conductive members and contacts on opposing sides

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Stacked semiconductor package having laser machined contacts

Semiconductor component with backside contacts and method of fabrication

Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer

Interposer and methods for fabricating same

Method for fabricating semiconductor components and interconnects with contacts on opposing sides

Stackable semiconductor package having conductive layer and insulating layers

Interposer and methods for fabricating same

Stackable semiconductor package having conductive layer and insulating layers and method of fabrication

Semiconductor package including flex circuit, interconnects and dense array external contacts

Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures

Computer including optical interconnect, memory unit, and method of assembling a computer

Stackable semiconductor package having conductive layer and insulating layers and method of fabrication

Semiconductor components having lasered machined conductive vias

Method of wafer level chip scale packaging

Probe card and test system for semiconductor wafers

Semiconductor test interconnect with variable flexure contacts

Semiconductor interconnect having laser machined contacts

Probe card and testing method for semiconductor wafers

Method for fabricating stackable chip scale semiconductor package

Wafer-level package and methods of fabricating

Temporary package, system, and method for testing semiconductor dice and chip scale packages

Semiconductor devices having interconnections using standardized bonding locations and methods of designing

Method for fabricating semiconductor components using focused laser beam

Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate

Semiconductor package including flex circuit, interconnects and dense array external contacts

Temporary semiconductor package having dense array external contacts

Universal wafer carrier for wafer level die burn-in

Probe card for semiconductor wafers and method and system for testing wafers

Carrier and system for testing bumped semiconductor components

Semiconductor package with bi-substrate die

Stacked semiconductor package and method of fabrication

Method, apparatus and system for testing bumped semiconductor components

Stackable chip scale semiconductor package with mating contacts on opposed surfaces

Packaging for semiconductor logic devices

Process of making a glass semiconductor package

Apparatus for testing semiconductor wafers