Inventor

CHEN DA JUNG

SG58 patents

⚠️ This page may combine multiple inventors who share the name “CHEN DA JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN DA JUNG

CYNTEC CO LTD

Package with stacked substrates

Stack frame for electrical connections and the method to fabricate thereof

Stack frame for electrical connections and the method to fabricate thereof

Power module package structure

Package device with electromagnetic interference shield

Stacked electronic structure

Electronic package structure

Construction for high density power module package

Construction for high density power module package (case II)

Electronic module

Electronic structure having a transformer

Stacked electronic module and method to make the same

Electronic structure having a transformer

Electronic package structure

Electronic module

Stack frame for electrical connections and the method to fabricate thereof

Electronic module

Three-dimensional package structure

Chip package structure

Package structure

Method to form a stacked electronic structure

Stack frame for electrical connections and the method to fabricate thereof

Three-dimensional package structure

Stacked electronic structure

Electronic package structure

Electronic module

Package structure and manufacturing method thereof

Electronic package structure comprising a magnetic body and an inductive element and method for making the same

CHEN DA-JUNG

Electronic package structure

Three-dimensional package structure

Three-dimensional package structure

Power conversion module

Power supply module

Three-dimensional package structure

Electronic package structure

Delta Electronics Int'l (Singapore) Pte Ltd

Package structure

Power module

Package structure

Package assembly

LU BAU-RU

Stack frame for electrical connections and the method to fabricate thereof

Stack frame for electrical connections and the method to fabricate thereof

Electronic package structure having side-wing parts outside of a package layer for dissipating heat and method for making the same

LEE HAN-HSIANG

MOSFET pair with stack capacitor and manufacturing method thereof

Package structure and manufacturing method thereof

Electronic package structure

DELTA ELECTRONICS INT L SINGAPORE PTE LTD

Package structure and stacked package module with the same

Package structure with direct bond copper substrate

DELTA ELECTRONICS INTL SINGAPORE PTE LTD

Embedded package structure

Package assembly

WEN CHAU-CHUN

Chip package structure including heat dissipation device and an insulation sheet