Power supply module

Abstract

A power-supply module includes at least one power-supply component, an inductor and a package. The inductor is disposed over the at least one power-supply components, and the at least a power-supply component and the inductor are disposed within the package. Besides, the power-supply module further comprises a printed circuit board, and the at least one power-supply component and the inductor are mounted to the printed circuit board. Moreover, the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.

What is claimed is: 
     
       1. A power-supply module, comprising:
 at least one power-supply component; 
 an inductor disposed over the at least one power-supply component, wherein the inductor has a magnetic body and a coil encapsulated in the magnetic body, wherein the magnetic body encloses the coil therein and contiguously extends into the hollow space formed by the coil, wherein the magnetic body further contiguously extends to a first lateral side of the at least one power-supply component; 
 a package, wherein the at least one power-supply component and the inductor are disposed within the package, wherein the package comprises epoxy resin to encapsulate the at least one power-supply component and the inductor; and 
 a first lead frame, wherein a first portion of the first lead frame is disposed between the at least one power-supply component and the inductor inside the package, and a second portion extending from the first portion of the first lead frame is disposed on a top or bottom surface of the package for connecting with an external circuit. 
 
     
     
       2. The power-supply module as claimed in  claim 1 , wherein the magnetic body further contiguously extends to a second lateral side of the at least one power-supply component. 
     
     
       3. The power-supply module as claimed in  claim 1 , wherein the at least one power-supply component comprises a plurality of electrical components that are electrically connected. 
     
     
       4. The power-supply module as claimed in  claim 1 , wherein the at least one power-supply component comprises a controller. 
     
     
       5. The power-supply module as claimed in  claim 1 , wherein the at least one power-supply component comprises a transistor. 
     
     
       6. The power-supply module as claimed in  claim 1 , wherein the at least one power-supply component comprises a resistor. 
     
     
       7. The power-supply module as claimed in  claim 1 , wherein the at least one power-supply component comprises a capacitor. 
     
     
       8. The power-supply module as claimed in  claim 1 , further comprising:
 a platform, wherein the at least one power-supply component and the inductor are mounted to the platform. 
 
     
     
       9. The power-supply module as claimed in  claim 1 , further comprising:
 a printed circuit board, wherein the at least one power-supply component and the inductor are mounted to the printed circuit board. 
 
     
     
       10. The power-supply module as claimed in  claim 1 , wherein the at least one power-supply component comprises a plurality of electrical components, further comprising: a circuit substrate disposed between the plurality of electrical components and the inductor, wherein the plurality of electrical components and the inductor are electrically connected to the circuit substrate. 
     
     
       11. A power-supply module, comprising:
 an electronic module comprising at least one power-supply component; 
 an inductor disposed over the electronic module, wherein the inductor has a magnetic body and a coil encapsulated in the magnetic body, wherein the magnetic body encloses the coil therein and contiguously extends into the hollow space formed by the coil, wherein the magnetic body further contiguously extends to a first lateral side of the electronic module; 
 a package, wherein the electronic module and the inductor are disposed within the package, wherein the package comprises epoxy resin to encapsulate the electronic module and the inductor; and 
 a first lead frame, wherein a first portion of the first lead frame is disposed between the electronic module and the inductor inside the package, and a second portion extending from the first portion of the first lead frame is disposed on a top or bottom surface of the package for connecting with an external circuit. 
 
     
     
       12. The power-supply module as claimed in  claim 11 , wherein the second portion of the lead frame extends from the first portion to said top or bottom surface of the package through a third portion of the lead frame disposed on a lateral surface of the package. 
     
     
       13. The power-supply module as claimed in  claim 11 , wherein the second portion of the lead frame extends from the first portion to said top or bottom surface of the package through a third portion of the lead frame disposed inside the package. 
     
     
       14. The power-supply module as claimed in  claim 11 , further comprising a second lead frame having a third portion disposed between the at least one power-supply component and the inductor inside the package, and a fourth portion extending from the third portion is disposed on the same surface on which the second portion of the first lead frame is disposed.