Inventor · disambiguated record
Da-Jung Chen
Also filed as: CHEN DA · CHEN DA-JUNG
65 granted patents·15 pending applications·281 citations·filing 2003–2025
98Inventor score
Files withCYNTEC CO LTD38NINGBO SEMICONDUCTOR INT CORP10CHEN DA-JUNG9DELTA ELECTRONICS INT’L SINGAPORE PTE LTD8DELTA ELECTRONICS INTL SINGAPORE PTE LTD5
Top patents by PatentIndex Score
80 records- 0198US9107290B1Package structure and stacked package module with the sameDELTA ELECTRONICS INT L SINGAPORE PTE LTD·Filed 2014·Granted Aug 11, 2015·66 cites·20 claims
- 0293US9514964B2Stack frame for electrical connections and the method to fabricate thereofLU BAU-RU·Filed 2015·Granted Dec 6, 2016·8 cites·20 claims
- 0390US8338933B2Three-dimensional package structureCHEN DA-JUNG·Filed 2011·Granted Dec 25, 2012·11 cites·9 claims
- 0489US9142426B2Stack frame for electrical connections and the method to fabricate thereofLU BAU-RU·Filed 2011·Granted Sep 22, 2015·8 cites·19 claims
- 0588US9978611B2Stack frame for electrical connections and the method to fabricate thereofCYNTEC CO LTD·Filed 2017·Granted May 22, 2018·4 cites·20 claims
- 0688US9741590B2Stack frame for electrical connections and the method to fabricate thereofCYNTEC CO LTD·Filed 2016·Granted Aug 22, 2017·4 cites·20 claims
- 0788US9425131B2Package structureDelta Electronics Int'l (Singapore) Pte Ltd·Filed 2014·Granted Aug 23, 2016·10 cites·20 claims
- 0887US11651890B2Electronic structure having a transformerCYNTEC CO LTD·Filed 2020·Granted May 16, 2023·1 cites·16 claims
- 0985US12094644B2Electronic structure having a transformerCYNTEC CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 1085US8269330B1MOSFET pair with stack capacitor and manufacturing method thereofLEE HAN-HSIANG·Filed 2011·Granted Sep 18, 2012·10 cites·29 claims
- 1185US7411278B2Package device with electromagnetic interference shieldCYNTEC CO LTD·Filed 2006·Granted Aug 12, 2008·17 cites·26 claims
- 1285US7405467B2Power module package structureCYNTEC CO LTD·Filed 2005·Granted Jul 29, 2008·15 cites·25 claims
- 1384US8837168B2Electronic package structureCYNTEC CO LTD·Filed 2013·Granted Sep 16, 2014·5 cites·15 claims
- 1483US8824165B2Electronic package structureCHEN DA-JUNG·Filed 2011·Granted Sep 2, 2014·7 cites·20 claims
- 1581US9111954B2Power conversion moduleCHEN DA-JUNG·Filed 2011·Granted Aug 18, 2015·8 cites·11 claims
- 1680US9906157B2Package assemblyDELTA ELECTRONICS INTL SINGAPORE PTE LTD·Filed 2016·Granted Feb 27, 2018·5 cites·10 claims
- 1780US9287231B2Package structure with direct bond copper substrateDELTA ELECTRONICS INT L SINGAPORE PTE LTD·Filed 2014·Granted Mar 15, 2016·5 cites·20 claims
- 1879US10199361B2Stacked electronic structureCYNTEC CO LTD·Filed 2018·Granted Feb 5, 2019·2 cites·20 claims
- 1979US8338928B2Three-dimensional package structureCHEN DA-JUNG·Filed 2007·Granted Dec 25, 2012·7 cites·22 claims
- 2076US9871463B2Power moduleDelta Electronics Int'l (Singapore) Pte Ltd·Filed 2016·Granted Jan 16, 2018·3 cites·18 claims
- 2176US9000576B2Package structure and manufacturing method thereofLEE HAN-HSIANG·Filed 2012·Granted Apr 7, 2015·4 cites·17 claims
- 2275US8247891B2Chip package structure including heat dissipation device and an insulation sheetWEN CHAU-CHUN·Filed 2009·Granted Aug 21, 2012·9 cites·19 claims
- 2375US6972479B2Package with stacked substratesCYNTEC CO LTD·Filed 2004·Granted Dec 6, 2005·27 cites·14 claims
- 2474US8619428B2Electronic package structureLEE HAN-HSIANG·Filed 2011·Granted Dec 31, 2013·4 cites·15 claims
- 2573US11031255B2Stack frame for electrical connections and the method to fabricate thereofCYNTEC CO LTD·Filed 2020·Granted Jun 8, 2021·0 cites·18 claims
- 2672US9673156B2Package structureDelta Electronics Int'l (Singapore) Pte Ltd·Filed 2016·Granted Jun 6, 2017·2 cites·14 claims
- 2772US7982304B2Chip package structureCYNTEC CO LTD·Filed 2009·Granted Jul 19, 2011·5 cites·12 claims
- 2871US11848146B2Stacked electronic module and method to make the sameCYNTEC CO LTD·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 2971US9913380B2Embedded package structureDELTA ELECTRONICS INTL SINGAPORE PTE LTD·Filed 2017·Granted Mar 6, 2018·2 cites·16 claims
- 3069US7551455B2Package structureCYNTEC CO LTD·Filed 2006·Granted Jun 23, 2009·5 cites·14 claims
- 3168US12219708B2Electronic moduleCYNTEC CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·19 claims
- 3267US10991681B2Three-dimensional package structureCYNTEC CO LTD·Filed 2020·Granted Apr 27, 2021·0 cites·10 claims
- 3366US9451701B2Electronic package structureCYNTEC CO LTD·Filed 2015·Granted Sep 20, 2016·1 cites·20 claims
- 3466US9271398B2Power supply moduleCHEN DA-JUNG·Filed 2012·Granted Feb 23, 2016·2 cites·14 claims
- 3565US10034379B2Stacked electronic structureCYNTEC CO LTD·Filed 2016·Granted Jul 24, 2018·0 cites·20 claims
- 3665US8906741B2Electronic package structure having side-wing parts outside of a package layer for dissipating heat and method for making the sameLU BAU-RU·Filed 2011·Granted Dec 9, 2014·2 cites·26 claims
- 3765US2025227845A1Power supply moduleCYNTEC CO LTD·Filed 2025·Application pending·0 cites
- 3863US11744009B2Electronic moduleCYNTEC CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·19 claims
- 3962US11430825B2Image capturing assembly, lens module and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Aug 30, 2022·0 cites·6 claims
- 4061US10861895B2Image capturing assembly and packaging method thereof, lens module and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Dec 8, 2020·0 cites·15 claims
- 4161US10593561B2Stack frame for electrical connections and the method to fabricate thereofCYNTEC CO LTD·Filed 2018·Granted Mar 17, 2020·0 cites·20 claims
- 4260US6775145B1Construction for high density power module package (case II)CYNTEC CO LTD·Filed 2003·Granted Aug 10, 2004·11 cites·12 claims
- 4358US9877408B2Package assemblyDelta Electronics Int'l (Singapore) Pte Ltd·Filed 2016·Granted Jan 23, 2018·1 cites·8 claims
- 4457US10741531B2Method to form a stacked electronic structureCYNTEC CO LTD·Filed 2018·Granted Aug 11, 2020·0 cites·18 claims
- 4557US6975513B2Construction for high density power module packageCYNTEC CO LTD·Filed 2003·Granted Dec 13, 2005·9 cites·5 claims
- 4657US2021320095A1Camera assembly, lens module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Application pending·0 cites
- 4756US10593656B2Three-dimensional package structureCYNTEC CO LTD·Filed 2017·Granted Mar 17, 2020·0 cites·5 claims
- 4855US2025224788A1Power supply systemCYNTEC CO LTD·Filed 2025·Application pending·0 cites
- 4954US11017934B2Electronic moduleCYNTEC CO LTD·Filed 2017·Granted May 25, 2021·0 cites·18 claims
- 5054US8253041B2Electronic element packaging moduleCHEN DA-JUNG·Filed 2010·Granted Aug 28, 2012·1 cites·25 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →