Camera assembly, lens module, and electronic device

Abstract

A camera assembly includes a photosensitive unit, including a photosensitive chip and an optical filter mounted on the photosensitive chip; functional components; and an encapsulation layer, embedded with the photosensitive unit and the functional components. The photosensitive chip and the functional components are exposed from a bottom surface of the encapsulation layer. A top surface of the encapsulation layer is higher than the photosensitive chip and functional components and exposes the optical filter. The photosensitive chip has soldering pads facing away from the bottom surface of the encapsulation layer. The functional components have soldering pads exposed from the bottom surface of the encapsulation layer. The camera assembly further includes a redistribution layer structure, disposed on the bottom surface of the encapsulation layer and electrically connecting to the soldering pads.

What is claimed is: 
     
         1 . A camera assembly, comprising:
 a photosensitive unit, including a photosensitive chip and an optical filter mounted on the photosensitive chip;   functional components;   an encapsulation layer, embedded with the photosensitive unit and the functional components, wherein:
 the photosensitive chip and the functional components are exposed from a bottom surface of the encapsulation layer, 
 a top surface of the encapsulation layer is higher than the photosensitive chip and functional components and exposes the optical filter, 
 the photosensitive chip has soldering pads facing away from the bottom surface of the encapsulation layer, and 
 the functional components have soldering pads exposed from the bottom surface of the encapsulation layer; and 
   a redistribution layer structure, disposed on the bottom surface of the encapsulation layer and electrically connecting to the soldering pads.   
     
     
         2 . The camera assembly according to  claim 1 , wherein the redistribution layer structure includes:
 conductive posts disposed in the photosensitive chip and electrically connected to the soldering pads of the photosensitive chip; and   interconnect lines disposed on the soldering pads of the functional components and the conductive posts and electrically connected to the soldering pads of the functional components and the conductive posts.   
     
     
         3 . The camera assembly according to  claim 1 , wherein:
 the encapsulation layer also covers a sidewall of the optical filter.   
     
     
         4 . The camera assembly according to  claim 3 , further including:
 a stress buffering layer disposed between the sidewall of the optical filter and the encapsulation layer.   
     
     
         5 . The camera assembly according to  claim 1 , wherein:
 the functional components include at least one of peripheral chips or passive components; and   the peripheral chips include one or two of digital signal processing chip and memory chip.   
     
     
         6 . The camera assembly according to  claim 1 , further including:
 a flexible printed circuit (FPC) board disposed on the redistribution layer structure.   
     
     
         7 . A lens module, comprising:
 a camera assembly, which includes:
 a photosensitive unit, including a photosensitive chip and an optical filter mounted on the photosensitive chip; 
 functional components; 
 an encapsulation layer, embedded with the photosensitive unit and the functional components, wherein:
 the photosensitive chip and the functional components are exposed from a bottom surface of the encapsulation layer, 
 a top surface of the encapsulation layer is higher than the photosensitive chip and functional components and exposes the optical filter, 
 the photosensitive chip has soldering pads facing away from the bottom surface of the encapsulation layer, and 
 the functional components have soldering pads exposed from the bottom surface of the encapsulation layer; and 
 
 a redistribution layer structure, disposed on the bottom surface of the encapsulation layer and electrically connecting to the soldering pads; and 
   a lens assembly, electrically connecting to the photosensitive chip and the functional components and including a frame mounted on the top surface of the encapsulation layer and surrounding the photosensitive unit and the functional components.   
     
     
         8 . An electronic device, comprising the lens module according to  claim 7 .