Inventor · disambiguated record
Mengbin Liu
Also filed as: LIU MENGBIN
18 granted patents·6 pending applications·11 citations·filing 2018–2023
88Inventor score
Top patents by PatentIndex Score
24 records- 0185US10490589B1Image sensor module and method for forming the sameNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Nov 26, 2019·5 cites·16 claims
- 0284US10930617B2Packaging method and package structure of wafer-level system-in-packageNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Feb 23, 2021·3 cites·20 claims
- 0371US10756056B2Methods and structures for wafer-level system in packageNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Aug 25, 2020·1 cites·20 claims
- 0468US11695387B2Air gap type semiconductor device package structure and fabrication method thereofNINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH·Filed 2019·Granted Jul 4, 2023·2 cites·17 claims
- 0565US11309279B2Package structure of wafer-level system-in-packageNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Apr 19, 2022·0 cites·5 claims
- 0662US11979136B2Air gap type semiconductor device package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Granted May 7, 2024·0 cites·16 claims
- 0762US11430825B2Image capturing assembly, lens module and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Aug 30, 2022·0 cites·6 claims
- 0861US10861895B2Image capturing assembly and packaging method thereof, lens module and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Dec 8, 2020·0 cites·15 claims
- 0961US2021280527A1Semiconductor deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Application pending·0 cites
- 1058US11444244B2Mask plate and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Sep 13, 2022·0 cites·5 claims
- 1158US10811385B2Wafer-level system-in-package structure and electronic apparatus thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 1257US11049816B2Alignment mark and semiconductor device, and fabrication methods thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Jun 29, 2021·0 cites·19 claims
- 1357US2021320095A1Camera assembly, lens module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Application pending·0 cites
- 1453US10861821B2Packaging method and package structure of wafer-level system-in-packageNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Dec 8, 2020·0 cites·11 claims
- 1550US11069670B2Camera assembly and packaging method thereof, lens module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Jul 20, 2021·0 cites·11 claims
- 1648US11917918B2Fingerprint identification module, method for forming fingerprint identification module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Feb 27, 2024·0 cites·9 claims
- 1748US10887499B2Camera assembly and packaging methods thereof, lens module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Jan 5, 2021·0 cites·20 claims
- 1846US2022045112A1Camera assembly, lens module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Application pending·0 cites
- 1942US2020098807A1Image sensor module and method for forming the sameNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Application pending·0 cites
- 2041US2019341265A1Mask and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Application pending·0 cites
- 2140US11296141B2Image capturing assembly and packaging method thereof, lens module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Apr 5, 2022·0 cites·13 claims
- 2240US2020161356A1Camera assembly and packaging method, lens module and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Application pending·0 cites
- 2339US11171166B2Camera assembly and packaging method thereof, lens module, electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Nov 9, 2021·0 cites·12 claims
- 2438US10755979B2Wafer-level packaging methods using a photolithographic bonding materialNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Aug 25, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →