Semiconductor device

Abstract

A semiconductor device is provided. The semiconductor device includes: a plurality of alignment dies, each including a diced first base substrate and at least one alignment mark on the diced first base substrate; a second base substrate; and a bonding film on the second base substrate. An alignment die of the plurality of alignment dies are attached on the bonding film on an alignment region of the second base substrate for aligning the second base substrate.

What is claimed is: 
     
         1 . A semiconductor device, comprising:
 a plurality of alignment dies, each including a diced first base substrate and at least one alignment mark on the diced first base substrate;   a second base substrate; and   a bonding film on the second base substrate, wherein:
 an alignment die of the plurality of alignment dies are attached on the bonding film on an alignment region of the second base substrate for aligning the second base substrate. 
   
     
     
         2 . The device according to  claim 1 , wherein:
 the first base substrate is a semiconductor material base substrate;   at least two alignment regions are arranged on the second base substrate; and   two alignment regions of the at least two alignment regions are arranged on opposite sides of the second base substrate.   
     
     
         3 . The device according to  claim 1 , wherein:
 a shape of the alignment mark of the at least one alignment mark includes one or more of a cross shape, a star shape, a circle shape, an ellipse shape, a rectangle shape, and a square shape.   
     
     
         4 . The device according to  claim 1 , wherein:
 a maximum size of an alignment mark of the at least one alignment mark is in a range of approximately 0.5 mm*0.5 mm to 10 mm*10 mm.   
     
     
         5 . The device according to  claim 1 , further including:
 a chip attached on a surface of the second base substrate on which the alignment die is attached.   
     
     
         6 . The device according to  claim 5 , wherein:
 the second base substrate is aligned with the chip through the alignment die, and   the chip is attached to the surface of the second base substrate through the bonding film.   
     
     
         7 . The device according to  claim 1 , wherein:
 the bonding film is made of one of a thermoplastic organic material, a thermosetting organic material, an inorganic material, a die attach film, and a dry film.   
     
     
         8 . The device according to  claim 7 , wherein:
 the inorganic material includes copper, nickel, chromium, cobalt, or a combination thereof.   
     
     
         9 . The device according to  claim 1 , wherein:
 an attach accuracy of the alignment die is smaller than or equal to about 3 μm.