Assignee
NINGBO SEMICONDUCTOR INT CORP
CN·48 granted patents·22 pending applications·20 citations·filing 2016–2024
Top patents by PatentIndex Score
70 records- 0196US11870410B2Packaging method and packaging structure of film bulk acoustic resonatorNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Jan 9, 2024·4 cites·14 claims
- 0285US10490589B1Image sensor module and method for forming the sameNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Nov 26, 2019·5 cites·16 claims
- 0384US10930617B2Packaging method and package structure of wafer-level system-in-packageNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Feb 23, 2021·3 cites·20 claims
- 0478US10790211B2Wafer-level packaging method and package structure thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Sep 29, 2020·2 cites·12 claims
- 0576US10804177B2Wafer-level packaging method and package structure thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Oct 13, 2020·2 cites·20 claims
- 0675US2024313738A1Packaging structure of film bulk acoustic resonatorNINGBO SEMICONDUCTOR INT CORP·Filed 2024·Application pending·0 cites
- 0774US10861822B2Wafer-level packaging method and package structure thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Dec 8, 2020·1 cites·13 claims
- 0872US2024106406A1Packaging structure of film bulk acoustic resonatorNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Application pending·0 cites
- 0971US10756056B2Methods and structures for wafer-level system in packageNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Aug 25, 2020·1 cites·20 claims
- 1069US11569790B2Method for forming film bulk acoustic resonatorNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Jan 31, 2023·0 cites·9 claims
- 1169US10910286B2Wafer-level system-in-package packaging method and package structure thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Feb 2, 2021·1 cites·20 claims
- 1269US10756051B2Wafer-level system packaging method and package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Aug 25, 2020·1 cites·20 claims
- 1367US11641184B2Film bulk acoustic resonatorNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted May 2, 2023·0 cites·20 claims
- 1466US11764245B2Fabrication method of photodetector and imaging sensorNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Sep 19, 2023·0 cites·15 claims
- 1566US2024186973A1Film bulk acoustic resonator and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2024·Application pending·0 cites
- 1665US11309279B2Package structure of wafer-level system-in-packageNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Apr 19, 2022·0 cites·5 claims
- 1764US11562980B2Wafer-level package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Jan 24, 2023·0 cites·7 claims
- 1864US11450582B2Wafer-level package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Sep 20, 2022·0 cites·10 claims
- 1964US11101311B2Photodetector and fabrication method, and imaging sensorNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Aug 24, 2021·0 cites·11 claims
- 2063US12028043B2Packaging method and packaging structure of FBARNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Jul 2, 2024·0 cites·16 claims
- 2162US11979136B2Air gap type semiconductor device package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Granted May 7, 2024·0 cites·16 claims
- 2262US11430825B2Image capturing assembly, lens module and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Aug 30, 2022·0 cites·6 claims
- 2361US10861895B2Image capturing assembly and packaging method thereof, lens module and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Dec 8, 2020·0 cites·15 claims
- 2461US2021280527A1Semiconductor deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Application pending·0 cites
- 2559US12009803B2Bulk acoustic wave resonator, filter and radio frequency communication systemNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 2659US10559516B2Method of fabricating RFIC deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2019·Granted Feb 11, 2020·0 cites·20 claims
- 2758US11942917B2Film bulk acoustic resonator and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Mar 26, 2024·0 cites·11 claims
- 2858US11444244B2Mask plate and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Sep 13, 2022·0 cites·5 claims
- 2958US10811385B2Wafer-level system-in-package structure and electronic apparatus thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 3057US11049816B2Alignment mark and semiconductor device, and fabrication methods thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Jun 29, 2021·0 cites·19 claims
- 3157US2021320095A1Camera assembly, lens module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Application pending·0 cites
- 3256US10784832B2Film bulk acoustic resonator and method of fabrication sameNINGBO SEMICONDUCTOR INT CORP·Filed 2016·Granted Sep 22, 2020·0 cites·12 claims
- 3355US10431518B2RFIC device and method of fabricating sameNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Oct 1, 2019·0 cites·20 claims
- 3455US2023336157A1Mems device and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Application pending·0 cites
- 3555US2023336149A1Mems device and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Application pending·0 cites
- 3654US12057820B2Thin film piezoelectric acoustic wave resonator and manufacturing method therefor, and filterNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Aug 6, 2024·0 cites·20 claims
- 3754US11201187B2CMOS image sensor packaging structure and fabrication method thereof, and camera deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 3854US2023198498A1Thin-film bulk acoustic wave resonator, forming method, and filterNINGBO SEMICONDUCTOR INT CORP·Filed 2023·Application pending·0 cites
- 3953US10861821B2Packaging method and package structure of wafer-level system-in-packageNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Dec 8, 2020·0 cites·11 claims
- 4052US12224730B2Manufacturing method of a composite substrate of an acoustic wave resonatorNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Granted Feb 11, 2025·0 cites·12 claims
- 4152US2023006644A1Film bulk acoustic resonator and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2022·Application pending·0 cites
- 4252US2023024466A1Film piezoelectric acoustic resonator, filter and electronic apparatusNINGBO SEMICONDUCTOR INT CORP·Filed 2022·Application pending·0 cites
- 4351US2022368310A1Film piezoelectric acoustic wave filter and fabrication method thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2022·Application pending·0 cites
- 4450US11069670B2Camera assembly and packaging method thereof, lens module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Jul 20, 2021·0 cites·11 claims
- 4550US2022352870A1Composite substrate, surface acoustic wave resonator, and fabricating methods thereofNINGBO SEMICONDUCTOR INT CORP·Filed 2022·Application pending·0 cites
- 4648US11917918B2Fingerprint identification module, method for forming fingerprint identification module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2021·Granted Feb 27, 2024·0 cites·9 claims
- 4748US10887499B2Camera assembly and packaging methods thereof, lens module, and electronic deviceNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Jan 5, 2021·0 cites·20 claims
- 4848US2022068986A1Method for manufacturing imaging moduleNINGBO SEMICONDUCTOR INT CORP·Filed 2020·Application pending·0 cites
- 4947US11130673B2Packaging method and packaging structureNINGBO SEMICONDUCTOR INT CORP·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 5047US10978421B2Wafer-level packaging method and package structureNINGBO SEMICONDUCTOR INT CORP·Filed 2018·Granted Apr 13, 2021·0 cites·20 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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