Inventor · disambiguated record
Chun-Tiao Liu
Also filed as: LIU CHUN · LIU CHUN-TIAO
31 granted patents·8 pending applications·353 citations·filing 2003–2024
97Inventor score
Top patents by PatentIndex Score
39 records- 0198US8723629B1Magnetic device with high saturation current and low core lossCYNTEC CO LTD·Filed 2013·Granted May 13, 2014·100 cites·19 claims
- 0295US9136050B2Magnetic device and method of manufacturing the sameHSIEH ROGER·Filed 2013·Granted Sep 15, 2015·16 cites·18 claims
- 0394US8471668B2Coil deviceHSIEH ROGER·Filed 2011·Granted Jun 25, 2013·30 cites·21 claims
- 0493US10902989B2Packaging structure of a magnetic deviceCYNTEC CO LTD·Filed 2018·Granted Jan 26, 2021·3 cites·22 claims
- 0593US9728331B2Method for making a chokeCYNTEC CO LTD·Filed 2014·Granted Aug 8, 2017·10 cites·20 claims
- 0691US2024234005A1Packaging Structure of a Magnetic DeviceCYNTEC CO LTD·Filed 2024·Application pending·0 cites
- 0790US8338933B2Three-dimensional package structureCHEN DA-JUNG·Filed 2011·Granted Dec 25, 2012·11 cites·9 claims
- 0890US7915993B2InductorCYNTEC CO LTD·Filed 2010·Granted Mar 29, 2011·13 cites·20 claims
- 0989US9230728B2Magnetic device with high saturation current and low core lossCYNTEC CO LTD·Filed 2014·Granted Jan 5, 2016·5 cites·12 claims
- 1089US7675396B2Inductor and manufacture method thereofCYNTEC CO LTD·Filed 2008·Granted Mar 9, 2010·20 cites·5 claims
- 1189US6879238B2Configuration and method for manufacturing compact high current inductor coilCYNTEC COMPANY·Filed 2003·Granted Apr 12, 2005·32 cites·20 claims
- 1288US9959965B2Packaging structure of a magnetic deviceCYNTEC CO LTD·Filed 2015·Granted May 1, 2018·2 cites·11 claims
- 1388US7339451B2InductorCYNTEC CO LTD·Filed 2004·Granted Mar 4, 2008·42 cites·18 claims
- 1486US7667565B2Current measurement using inductor coil with compact configuration and low TCR alloysCYNTEC CO LTD·Filed 2005·Granted Feb 23, 2010·14 cites·15 claims
- 1585US9805860B2Magnetic device and method of manufacturing the sameCYNTEC CO LTD·Filed 2017·Granted Oct 31, 2017·4 cites·20 claims
- 1685US7405467B2Power module package structureCYNTEC CO LTD·Filed 2005·Granted Jul 29, 2008·15 cites·25 claims
- 1784US8837168B2Electronic package structureCYNTEC CO LTD·Filed 2013·Granted Sep 16, 2014·5 cites·15 claims
- 1883US8824165B2Electronic package structureCHEN DA-JUNG·Filed 2011·Granted Sep 2, 2014·7 cites·20 claims
- 1979US8338928B2Three-dimensional package structureCHEN DA-JUNG·Filed 2007·Granted Dec 25, 2012·7 cites·22 claims
- 2078US11967446B2Packaging structure of a magnetic deviceCYNTEC CO LTD·Filed 2021·Granted Apr 23, 2024·0 cites·12 claims
- 2177US9129769B2Protective deviceWANG CHUNG-HSIUNG·Filed 2010·Granted Sep 8, 2015·4 cites·22 claims
- 2274US9576710B2Magnetic device and method of manufacturing the sameHSIEH ROGER·Filed 2015·Granted Feb 21, 2017·2 cites·20 claims
- 2372US10433424B2Electronic module and the fabrication method thereofCYNTEC CO LTD·Filed 2015·Granted Oct 1, 2019·2 cites·13 claims
- 2469US7551455B2Package structureCYNTEC CO LTD·Filed 2006·Granted Jun 23, 2009·5 cites·14 claims
- 2567US10991681B2Three-dimensional package structureCYNTEC CO LTD·Filed 2020·Granted Apr 27, 2021·0 cites·10 claims
- 2666US9451701B2Electronic package structureCYNTEC CO LTD·Filed 2015·Granted Sep 20, 2016·1 cites·20 claims
- 2766US9271398B2Power supply moduleCHEN DA-JUNG·Filed 2012·Granted Feb 23, 2016·2 cites·14 claims
- 2863US9336978B2Protective deviceCYNTEC CO LTD·Filed 2013·Granted May 10, 2016·1 cites·17 claims
- 2956US10593656B2Three-dimensional package structureCYNTEC CO LTD·Filed 2017·Granted Mar 17, 2020·0 cites·5 claims
- 3053US9601412B2Three-dimensional package structureCHEN DA-JUNG·Filed 2012·Granted Mar 21, 2017·0 cites·17 claims
- 3153US9001527B2Electronic package structureCHEN DA-JUNG·Filed 2012·Granted Apr 7, 2015·0 cites·15 claims
- 3253US2010308950A1ChokeCYNTEC CO LTD·Filed 2009·Application pending·0 cites
- 3352US9538660B2Electronic package structureCYNTEC CO LTD·Filed 2015·Granted Jan 3, 2017·0 cites·18 claims
- 3452US2009207574A1Electronic package structureCYNTEC CO LTD·Filed 2008·Application pending·0 cites
- 3548US2011090648A1Electronic package structureCYNTEC CO LTD·Filed 2010·Application pending·0 cites
- 3644US2022208577A1Manipulator finger, manipulator, and method of operating the samePIOTECH INC·Filed 2021·Application pending·0 cites
- 3743US2007075826A1Method for manufacturing chip resistor networksLIU CHUN-TIAO·Filed 2006·Application pending·0 cites
- 3840US2006284340A1Method for preventing the overflowing of molding compound during fabricating package deviceCYNTEC CO LTD·Filed 2005·Application pending·0 cites
- 3940US2006220188A1Package structure having mixed circuit and composite substrateCYNTEC CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →