Inventor

CHEN LING

US276 patents

⚠️ This page may combine multiple inventors who share the name “CHEN LING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN LING

APPLIED MATERIALS INC

Apparatus for hybrid chemical processing

Apparatus and method for hybrid chemical processing

Apparatus for providing gas to a processing chamber

Cyclical deposition of refractory metal silicon nitride

Gas delivery apparatus and method for atomic layer deposition

Method and apparatus of generating PDMAT precursor

Method of film deposition using activated precursor gases

Methods and apparatus for forming barrier layers in high aspect ratio vias

Process for removing an underlying layer and depositing a barrier layer in one reactor

Copper interconnect barrier layer structure and formation method

Method of using a barrier sputter reactor to remove an underlying barrier layer

Deposition of copper with increased adhesion

CVD method of depositing copper films by using improved organocopper precursor blend

Gas delivery apparatus for atomic layer deposition

Noble metal layer formation for copper film deposition

Apparatus and method for hybrid chemical processing

Valve design and configuration for fast delivery system

Tantalum barrier layer for copper metallization

Method and apparatus for monitoring solid precursor delivery

Barrier layer structure for copper metallization and method of forming the structure

Deposition of tungsten nitride by plasma enhanced chemical vapor deposition

Pattern of apertures in a showerhead for chemical vapor deposition

Method for unreacted precursor conversion and effluent removal

Chemical vapor deposition hot-trap for unreacted precursor conversion and effluent removal

Construction of a tantalum nitride film on a semiconductor wafer

Method and apparatus for providing precursor gas to a processing chamber

Method and apparatus of generating PDMAT precursor

Valve design and configuration for fast delivery system

Reliability barrier integration for Cu application

Methods and apparatus for forming barrier layers in high aspect ratio vias

Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor

Selective deposition of a barrier layer on a dielectric material

Integration of barrier layer and seed layer

Nitrogen analogs of copper II β-diketonates as source reagents for semiconductor processing

CVD TiSiN barrier for copper integration

Method and apparatus for gas temperature control in a semiconductor processing system

Methods and apparatus for improved vaporization of deposition material in a substrate processing system

TAIWAN SEMICONDUCTOR MFG

Process for manufacturing a plug-diode mask ROM

Method for making self-aligned source/drain mask ROM memory cell using trench etched channel

Planarized plug-diode mask ROM structure

Method of manufacturing metallic source line, self-aligned contact for flash memory devices

Method of manufacturing self-aligned bit-line during EPROM fabrication

DONGGUAN YIHE SILICONE & RUBBER TECH CO LTD

Cases for portable computers

Protective case for tablet computer

Protective case for tablet computer

Protective case with stand for tablet computer

Protective case with stand for tablet computer

MACRONIX INT CO LTD

Floating gate or flash EPROM transistor array having contactless source and drain diffusions

Method of making a non-volatile memory cell

IBM

Tiered storage optimization and migration