Inventor
LIN HSING-CHIH
TW67 patents
Patents
50 patentsUS11063038B2Jul 13, 2021
Through silicon via design for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10964692B2Mar 30, 2021
Through silicon via design for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10727205B2Jul 28, 2020
Hybrid bonding technology for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10629592B2Apr 21, 2020
Through silicon via design for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10510592B2Dec 17, 2019
Integrated circuit (IC) structure for high performance and functional density
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10157946B2Dec 18, 2018
Method for forming CMOS image sensor structure
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9818779B2Nov 14, 2017
CMOS image sensor structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9246084B2Jan 26, 2016
RRAM cell including V-shaped structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11195818B2Dec 7, 2021
Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US12315843B2May 27, 2025
Hybrid bonding technology for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations75
US11942368B2Mar 26, 2024
Through silicon vias and methods of fabricating thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations75
US11996429B2May 28, 2024
CMOS image sensor structure with microstructures on backside surface of semiconductor layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11955428B2Apr 9, 2024
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11791332B2Oct 17, 2023
Stacked semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11756862B2Sep 12, 2023
Oversized via as through-substrate-via (TSV) stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11705449B2Jul 18, 2023
Through silicon via design for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11410972B2Aug 9, 2022
Hybrid bonding technology for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11404534B2Aug 2, 2022
Backside capacitor techniques
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11322481B2May 3, 2022
Hybrid bonding technology for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11282769B2Mar 22, 2022
Oversized via as through-substrate-via (TSV) stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11222814B2Jan 11, 2022
Integrated circuit (IC) structure for high performance and functional density
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11177302B2Nov 16, 2021
CMOS image sensor structure with microstructures formed on semiconductor layer
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10916502B2Feb 9, 2021
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10811398B2Oct 20, 2020
Semiconductor structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10504784B2Dec 10, 2019
Inductor structure for integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10163878B2Dec 25, 2018
Semiconductor structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9620553B2Apr 11, 2017
CMOS image sensor structure with crosstalk improvement
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9397130B1Jul 19, 2016
CMOS image sensor structure with crosstalk improvement
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9257486B2Feb 9, 2016
RRAM array having lateral RRAM cells and vertical conducting structures
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11756920B2Sep 12, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9263437B2Feb 16, 2016
Mechanisms for forming metal-insulator-metal (MIM) capacitor structure
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations71
US12057446B2Aug 6, 2024
Stacked semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12034037B2Jul 9, 2024
Backside capacitor techniques
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11646308B2May 9, 2023
Through silicon via design for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11424228B2Aug 23, 2022
Semiconductor structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11387167B2Jul 12, 2022
Semiconductor structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11217478B2Jan 4, 2022
Integrated circuit (IC) structure for high performance and functional density
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10049981B2Aug 14, 2018
Through via structure, semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12300669B2May 13, 2025
Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205868B2Jan 21, 2025
Oversized via as through-substrate-via (TSV) stop layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11862535B2Jan 2, 2024
Through-substrate-via with reentrant profile
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11694997B2Jul 4, 2023
Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9502556B2Nov 22, 2016
Integrated fabrication of semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US12283564B2Apr 22, 2025
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12230554B2Feb 18, 2025
Shield structure for backside through substrate vias (TSVs)
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12218106B2Feb 4, 2025
Backside contact to improve thermal dissipation away from semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12033919B2Jul 9, 2024
Backside or frontside through substrate via (TSV) landing on metal
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US11764129B2Sep 19, 2023
Method of forming shield structure for backside through substrate vias (TSVS)
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11756936B2Sep 12, 2023
Backside contact to improve thermal dissipation away from semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11289455B2Mar 29, 2022
Backside contact to improve thermal dissipation away from semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
Showing the top 50 of 67 patents by PatentIndex Score.