Inventor

KARAVAKIS KONSTANTINE

US64 patents

⚠️ This page may combine multiple inventors who share the name “KARAVAKIS KONSTANTINE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KARAVAKIS KONSTANTINE

TESSERA INC

Microelectronic package having a compliant layer with bumped protrusions

Method of making compliant microelectronic assemblies

Semiconductor chip package with fan-in leads

Flexible connectors for microelectronic elements

Method of forming compliant microelectronic mounting device

Microelectronic component mounting with deformable shell terminals

Compliant integrated circuit package and method of fabricating the same

Method of encapsulating a semiconductor package

Compliant microelectrionic mounting device

Microelectronic assemblies having compliant layers

Compliant integrated circuit package

Method of encapsulating die and chip carrier

Microelectronic assemblies having compliant layers

Microelectronic assemblies having compliant layers

Image forming apparatus with improved transfer efficiency

Compliant microelectronic assemblies

Compliant microelectronic mounting device

Microelectronic component mounting with deformable shell terminals

Methods of making semiconductor assemblies with reinforced peripheral regions

Semiconductor connection component with frangible lead sections

Semiconductor assemblies with reinforced peripheral regions

Manufacture of semiconductor connection components with frangible lead sections

Method for making a flexible lead for a microelectronic device

Method of making components with releasable leads

Method of making components with releasable leads

Components with releasable leads

Method of making components with releasable leads

Components with releasable leads

Semiconductor assemblies with reinforced peripheral regions

Components with releasable leads

Manufacture of semiconductor connection components with frangible lead sections

Method of making a compliant integrated circuit package

Compliant lead structures for microelectronic devices

Structure and method for making a compliant lead for a microelectronic device

Connection component with peelable leads

Method of making connection component

Enhancements in sheet processing and lead formation

Enhancements in sheet processing and lead formation

Semiconductor assemblies with reinforced peripheral regions

SIERRA CIRCUITS INC

Catalytic laminate apparatus and method

Integrated circuit wafer integration with catalytic laminate or adhesive

Process for forming traces on a catalytic laminate

Process for printed circuit boards using backing foil

KARAVAKIS KONSTANTINE

Via in a printed circuit board

Method for forming traces of a printed circuit board

FJELSTAD JOSEPH

Microelectronic assemblies having compliant layers

Methods of making compliant semiconductor chip packages

CENTIPEDE SYSTEMS INC

Self-cleaning socket for microelectronic devices

CATLAM LLC

Process for fabrication of a printed circuit board using a semi-additive process and removable backing foil

BAHL KENNETH S

Methods for forming embedded traces