Inventor
KLAWUHN ERICH
US9 patents
⚠️ This page may combine multiple inventors who share the name “KLAWUHN ERICH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NOVELLUS SYSTEMS INC
8 patentsUS6607977B1Aug 19, 2003
Method of depositing a diffusion barrier for copper interconnect applications
NOVELLUS SYSTEMS INC159 citations99
US6642146B1Nov 4, 2003
Method of depositing copper seed on semiconductor substrates
NOVELLUS SYSTEMS INC121 citations98
US6566246B1May 20, 2003
Deposition of conformal copper seed layers by control of barrier layer morphology
NOVELLUS SYSTEMS INC147 citations97
US6541374B1Apr 1, 2003
Method of depositing a diffusion barrier for copper interconnection applications
NOVELLUS SYSTEMS INC85 citations96
US6554914B1Apr 29, 2003
Passivation of copper in dual damascene metalization
NOVELLUS SYSTEMS INC62 citations95
US6319842B1Nov 20, 2001
Method of cleansing vias in semiconductor wafer having metal conductive layer
NOVELLUS SYSTEMS INC56 citations93
US8679972B1Mar 25, 2014
Method of depositing a diffusion barrier for copper interconnect applications
NOVELLUS SYSTEMS INC19 citations92
US9099535B1Aug 4, 2015
Method of depositing a diffusion barrier for copper interconnect applications
NOVELLUS SYSTEMS INC4 citations84