Inventor
WU HUI-JUNG
US44 patents
⚠️ This page may combine multiple inventors who share the name “WU HUI-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
13 patentsUS11322351B2May 3, 2022
Tin oxide films in semiconductor device manufacturing
LAM RES CORP15 citations94
US10546748B2Jan 28, 2020
Tin oxide films in semiconductor device manufacturing
LAM RES CORP25 citations94
US12094711B2Sep 17, 2024
Tin oxide films in semiconductor device manufacturing
LAM RES CORP5 citations86
US11355353B2Jun 7, 2022
Tin oxide mandrels in patterning
LAM RES CORP15 citations85
US9418889B2Aug 16, 2016
Selective formation of dielectric barriers for metal interconnects in semiconductor devices
LAM RES CORP8 citations84
US12437995B2Oct 7, 2025
Tin oxide films in semiconductor device manufacturing
LAM RES CORP1 citations75
US12417916B2Sep 16, 2025
Tin oxide films in semiconductor device manufacturing
LAM RES CORP1 citations75
US12183589B2Dec 31, 2024
Tin oxide mandrels in patterning
LAM RES CORP3 citations74
US11987876B2May 21, 2024
Chamfer-less via integration scheme
LAM RES CORP6 citations73
US10199235B2Feb 5, 2019
Liner and barrier applications for subtractive metal integration
LAM RES CORP2 citations72
US11792987B2Oct 17, 2023
Self-aligned vertical integration of three-terminal memory devices
LAM RES CORP0 citations59
US9899234B2Feb 20, 2018
Liner and barrier applications for subtractive metal integration
LAM RES CORP1 citations51
US12080592B2Sep 3, 2024
Film stack simplification for high aspect ratio patterning and vertical scaling
LAM RES CORP0 citations46
HONEYWELL INT INC
9 patentsUS6605362B2Aug 12, 2003
Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
HONEYWELL INT INC38 citations95
US6495479B1Dec 17, 2002
Simplified method to produce nanoporous silicon-based films
HONEYWELL INT INC92 citations95
US6395649B1May 28, 2002
Low dielectric constant polyorganosilicon coatings generated from polycarbosilanes
HONEYWELL INT INC35 citations93
US6914114B2Jul 5, 2005
Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
HONEYWELL INT INC18 citations92
US6489030B1Dec 3, 2002
Low dielectric constant films used as copper diffusion barrier
HONEYWELL INT INC43 citations92
US6214746B1Apr 10, 2001
Nanoporous material fabricated using a dissolvable reagent
HONEYWELL INT INC52 citations92
US6780517B2Aug 24, 2004
Polycarbosilane adhesion promoters for low dielectric constant polymeric materials
HONEYWELL INT INC13 citations82
US6761975B1Jul 13, 2004
Polycarbosilane adhesion promoters for low dielectric constant polymeric materials
HONEYWELL INT INC13 citations82
US6841256B2Jan 11, 2005
Low dielectric constant polyorganosilicon materials generated from polycarbosilanes
HONEYWELL INT INC4 citations60
ALLIED SIGNAL INC
8 patentsUS6208014B1Mar 27, 2001
Use of multifunctional reagents for the surface modification of nanoporous silica films
ALLIED SIGNAL INC83 citations97
US6518205B1Feb 11, 2003
Multifunctional reagents for the surface modification of nanoporous silica films
ALLIED SIGNAL INC34 citations96
US6225238B1May 1, 2001
Low dielectric constant polyorganosilicon coatings generated from polycarbosilanes
ALLIED SIGNAL INC51 citations96
US6140254AOct 31, 2000
Edge bead removal for nanoporous dielectric silica coatings
ALLIED SIGNAL INC59 citations96
US6318124B1Nov 20, 2001
Nanoporous silica treated with siloxane polymers for ULSI applications
ALLIED SIGNAL INC101 citations95
US6037275AMar 14, 2000
Nanoporous silica via combined stream deposition
ALLIED SIGNAL INC85 citations95
US6770572B1Aug 3, 2004
Use of multifunctional si-based oligomer/polymer for the surface modification of nanoporous silica films
ALLIED SIGNAL INC35 citations92
US6495906B2Dec 17, 2002
Simplified process for producing nanoporous silica
ALLIED SIGNAL INC26 citations91
NOVELLUS SYSTEMS INC
4 patentsUS7576006B1Aug 18, 2009
Protective self-aligned buffer layers for damascene interconnects
NOVELLUS SYSTEMS INC55 citations98
US8021486B1Sep 20, 2011
Protective self-aligned buffer layers for damascene interconnects
NOVELLUS SYSTEMS INC14 citations92
US8017523B1Sep 13, 2011
Deposition of doped copper seed layers having improved reliability
NOVELLUS SYSTEMS INC27 citations92
US7704873B1Apr 27, 2010
Protective self-aligned buffer layers for damascene interconnects
NOVELLUS SYSTEMS INC14 citations92
COLGATE PALMOLIVE CO
2 patentsUS5874069AFeb 23, 1999
Cosmetic composition containing silicon-modified amides as thickening agents and method of forming same
COLGATE PALMOLIVE CO460 citations98
US5919441AJul 6, 1999
Cosmetic composition containing thickening agent of siloxane polymer with hydrogen-bonding groups
COLGATE PALMOLIVE CO501 citations97