Inventor · disambiguated record
Ping-Heng Wu
Also filed as: WU PING · WU PING-HENG
35 granted patents·9 pending applications·70 citations·filing 1996–2023
94Inventor score
Files withCHANGXIN MEMORY TECH INC25DELTA ELECTRONICS INC5GENEMIND BIOSCIENCES CO LTD4NANYA TECHNOLOGY CORP2AGERE SYST GUARDIAN CORP1
Top patents by PatentIndex Score
44 records- 0187US9659886B2Method of fabricating semiconductor device having voids between top metal layers of metal interconnectsNANYA TECHNOLOGY CORP·Filed 2016·Granted May 23, 2017·7 cites·7 claims
- 0275US5802091ATantalum-aluminum oxide coatings for semiconductor devicesLUCENT TECHNOLOGIES INC·Filed 1996·Granted Sep 1, 1998·43 cites·13 claims
- 0374US10427154B2Chip and application thereofGENEMIND BIOSCIENCES CO LTD·Filed 2016·Granted Oct 1, 2019·1 cites·9 claims
- 0467US10981164B2Chip and application thereofGENEMIND BIOSCIENCES CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·15 claims
- 0567US9416995B2Heating and cooling unit with semiconductor device and heat pipeSPRING (U S A ) CORP·Filed 2014·Granted Aug 16, 2016·2 cites·19 claims
- 0665US12051982B2Method of clamping output current of three-phase power converterDELTA ELECTRONICS INC·Filed 2022·Granted Jul 30, 2024·0 cites·10 claims
- 0760US12027379B2Package substrate and method of forming the same, package structure and method of forming the sameCHANGXIN MEMORY TECH INC·Filed 2020·Granted Jul 2, 2024·0 cites·18 claims
- 0860US12002748B2Contact window structure, metal plug and forming method thereof, and semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jun 4, 2024·0 cites·11 claims
- 0960US10301676B2Nucleic acid sequencing systemDIRECT GENOMICS CO LTD·Filed 2017·Granted May 28, 2019·1 cites·19 claims
- 1060US6734036B2Semiconductor device and method of fabricationAGERE SYSTEMS INC·Filed 2002·Granted May 11, 2004·8 cites·12 claims
- 1159US12132076B2Capacitance structure and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 29, 2024·0 cites·20 claims
- 1259US12068239B2Semiconductor structure with conductive plug and capacitor arrayCHANGXIN MEMORY TECH INC·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 1358US12317470B2Semiconductor device, semiconductor structure and formation method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted May 27, 2025·0 cites·7 claims
- 1458US11961798B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Apr 16, 2024·0 cites·15 claims
- 1558US11798904B2Semiconductor structure, redistribution layer (RDL) structure, and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Oct 24, 2023·0 cites·21 claims
- 1658US11605605B2Redistribution layer (RDL) structure, semiconductor device and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Mar 14, 2023·0 cites·20 claims
- 1757US12218034B2Semiconductor structure and method for manufacturing semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 4, 2025·0 cites·12 claims
- 1857US12009324B2Semiconductor structure and method for forming semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Jun 11, 2024·0 cites·16 claims
- 1957US11929280B2Contact window structure and method for forming contact window structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted Mar 12, 2024·0 cites·13 claims
- 2056US12270851B2Switch short-circuited diagnosis methodDELTA ELECTRONICS INC·Filed 2023·Granted Apr 8, 2025·0 cites·15 claims
- 2155US12224206B2Conductive structure, semiconductor structure and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Feb 11, 2025·0 cites·10 claims
- 2255US12136553B2Opening structure and forming method thereof, contact plug structure and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2022·Granted Nov 5, 2024·0 cites·14 claims
- 2355US12119234B2Semiconductor structure and method for manufacturing sameCHANGXIN MEMORY TECH INC·Filed 2022·Granted Oct 15, 2024·0 cites·5 claims
- 2455US11990390B2Semiconductor structureCHANGXIN MEMORY TECH INC·Filed 2021·Granted May 21, 2024·0 cites·12 claims
- 2554US12218032B2Semiconductor apparatus and manufacturing method thereof, and three-dimensional integrated circuitCHANGXIN MEMORY TECH INC·Filed 2022·Granted Feb 4, 2025·0 cites·8 claims
- 2651US6824039B2Lead free tin based solder compositionINST OF HIGH PERFORMANCE COMPU·Filed 2002·Granted Nov 30, 2004·7 cites·37 claims
- 2750US12426233B2Semiconductor device and manufacturing method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Granted Sep 23, 2025·0 cites·6 claims
- 2850US2022028796A1Semiconductor structure and forming method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 2950US2022084966A1Bonding pad structure, semiconductor structure, semiconductor package structure and method for preparing sameCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 3048US11870382B2Matrix power conversion device and control method thereofDELTA ELECTRONICS INC·Filed 2022·Granted Jan 9, 2024·0 cites·11 claims
- 3148US11711029B2Method of controlling power converter and power converterDELTA ELECTRONICS INC·Filed 2022·Granted Jul 25, 2023·0 cites·15 claims
- 3248US9418949B2Semiconductor device having voids between top metal layers of metal interconnectsNANYA TECHNOLOGY CORP·Filed 2013·Granted Aug 16, 2016·0 cites·9 claims
- 3347US2022262750A1A Semiconductor Device and a Method Making the SameCHANGXIN MEMORY TECH INC·Filed 2020·Application pending·0 cites
- 3446US2023215815A1Wafer and method of making, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2020·Application pending·0 cites
- 3546US2021280563A1Semiconductor device, fabrication method thereof, package and fabrication method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 3645US11931742B2Carrying module, nucleic acid loading device and use thereofGENEMIND BIOSCIENCES CO LTD·Filed 2018·Granted Mar 19, 2024·0 cites·18 claims
- 3745US11587893B2Distribution layer structure and manufacturing method thereof, and bond pad structureCHANGXIN MEMORY TECH INC·Filed 2020·Granted Feb 21, 2023·0 cites·19 claims
- 3845US2023230936A1Wafer and method of making, and semiconductor deviceCHANGXIN MEMORY TECH INC·Filed 2020·Application pending·0 cites
- 3945US2021265199A1Semiconductor device and fabricating method thereofCHANGXIN MEMORY TECH INC·Filed 2021·Application pending·0 cites
- 4043US6437425B1Semiconductor devices which utilize low K dielectricsAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 20, 2002·1 cites·9 claims
- 4143US2013174577A1Heating and Cooling Unit with Semiconductor Device and Heat PipeBRIJA FRANCIS THOMAS·Filed 2012·Application pending·0 cites
- 4240US11611291B2Power system and pulse width modulation method thereforDELTA ELECTRONICS INC·Filed 2021·Granted Mar 21, 2023·0 cites·18 claims
- 4335US10481094B2Total internal reflection fluorescence imaging system and sequencing deviceGENEMIND BIOSCIENCES CO LTD·Filed 2016·Granted Nov 19, 2019·0 cites·12 claims
- 4426US2003183675A1Lead free tin based solder compositionHIGH PERFORMANCE COMPUTING·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →