Inventor
ALAGARATNAM MANIAM
US23 patents
Patents
23 patentsUS6081997AJul 4, 2000
System and method for packaging an integrated circuit using encapsulant injection
LSI LOGIC CORP202 citations99
US5886398AMar 23, 1999
Molded laminate package with integral mold gate
LSI LOGIC CORP184 citations99
US5814881ASep 29, 1998
Stacked integrated chip package and method of making same
LSI LOGIC CORP229 citations99
US6335491B1Jan 1, 2002
Interposer for semiconductor package assembly
LSI LOGIC CORP129 citations98
US6225695B1May 1, 2001
Grooved semiconductor die for flip-chip heat sink attachment
LSI LOGIC CORP123 citations98
US5923047AJul 13, 1999
Semiconductor die having sacrificial bond pads for die test
LSI LOGIC CORP78 citations96
US5841191ANov 24, 1998
Ball grid array package employing raised metal contact rings
LSI LOGIC CORP58 citations96
US5744084AApr 28, 1998
Method of improving molding of an overmolded package body on a substrate
LSI LOGIC CORP54 citations96
US6608376B1Aug 19, 2003
Integrated circuit package substrate with high density routing mechanism
LSI LOGIC CORP81 citations95
US6618938B1Sep 16, 2003
Interposer for semiconductor package assembly
LSI LOGIC CORP31 citations92
US6586825B1Jul 1, 2003
Dual chip in package with a wire bonded die mounted to a substrate
LSI LOGIC CORP23 citations92
US5927505AJul 27, 1999
Overmolded package body on a substrate
LSI LOGIC CORP26 citations92
US5869889AFeb 9, 1999
Thin power tape ball grid array package
LSI LOGIC CORP43 citations92
US5841198ANov 24, 1998
Ball grid array package employing solid core solder balls
LSI LOGIC CORP32 citations92
US5353193AOct 4, 1994
High power dissipating packages with matched heatspreader heatsink assemblies
LSI LOGIC CORP35 citations92
US6297550B1Oct 2, 2001
Bondable anodized aluminum heatspreader for semiconductor packages
LSI LOGIC CORP16 citations84
US6429534B1Aug 6, 2002
Interposer tape for semiconductor package
LSI LOGIC CORP7 citations74
US6057594AMay 2, 2000
High power dissipating tape ball grid array package
LSI LOGIC CORP13 citations74
US7041516B2May 9, 2006
Multi chip module assembly
LSI LOGIC CORP7 citations73
US6433565B1Aug 13, 2002
Test fixture for flip chip ball grid array circuits
LSI LOGIC CORP10 citations73
US5386144AJan 31, 1995
Snap on heat sink attachment
LSI LOGIC CORP14 citations70
US6110815AAug 29, 2000
Electroplating fixture for high density substrates
LSI LOGIC CORP6 citations63
US6777314B2Aug 17, 2004
Method of forming electrolytic contact pads including layers of copper, nickel, and gold
LSI LOGIC CORP1 citations52