Inventor
LOW QWAI H
US42 patents
⚠️ This page may combine multiple inventors who share the name “LOW QWAI H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
28 patentsUS5973393AOct 26, 1999
Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits
LSI LOGIC CORP169 citations99
US5886398AMar 23, 1999
Molded laminate package with integral mold gate
LSI LOGIC CORP184 citations99
US5814881ASep 29, 1998
Stacked integrated chip package and method of making same
LSI LOGIC CORP229 citations99
US5923047AJul 13, 1999
Semiconductor die having sacrificial bond pads for die test
LSI LOGIC CORP78 citations96
US5841191ANov 24, 1998
Ball grid array package employing raised metal contact rings
LSI LOGIC CORP58 citations96
US6798035B1Sep 28, 2004
Bonding pad for low k dielectric
LSI LOGIC CORP20 citations92
US6114189ASep 5, 2000
Molded array integrated circuit package
LSI LOGIC CORP51 citations92
US5353193AOct 4, 1994
High power dissipating packages with matched heatspreader heatsink assemblies
LSI LOGIC CORP35 citations92
US5463529AOct 31, 1995
High power dissipating packages with matched heatspreader heatsink assemblies
LSI LOGIC CORP24 citations91
US6329278B1Dec 11, 2001
Multiple row wire bonding with ball bonds of outer bond pads bonded on the leads
LSI LOGIC CORP40 citations90
US6963138B2Nov 8, 2005
Dielectric stack
LSI LOGIC CORP15 citations84
US6743979B1Jun 1, 2004
Bonding pad isolation
LSI LOGIC CORP16 citations84
US6825563B1Nov 30, 2004
Slotted bonding pad
LSI LOGIC CORP17 citations82
US6573113B1Jun 3, 2003
Integrated circuit having dedicated probe pads for use in testing densely patterned bonding pads
LSI LOGIC CORP13 citations79
US6429534B1Aug 6, 2002
Interposer tape for semiconductor package
LSI LOGIC CORP7 citations74
US6057594AMay 2, 2000
High power dissipating tape ball grid array package
LSI LOGIC CORP13 citations74
US6040632AMar 21, 2000
Multiple sized die
LSI LOGIC CORP11 citations74
US5568683AOct 29, 1996
Method of cooling a packaged electronic device
LSI LOGIC CORP8 citations72
US5386144AJan 31, 1995
Snap on heat sink attachment
LSI LOGIC CORP14 citations70
US6489571B1Dec 3, 2002
Molded tape ball grid array package
LSI LOGIC CORP3 citations63
US6143586ANov 7, 2000
Electrostatic protected substrate
LSI LOGIC CORP5 citations63
US5973397AOct 26, 1999
Semiconductor device and fabrication method which advantageously combine wire bonding and tab techniques to increase integrated circuit I/O pad density
LSI LOGIC CORP3 citations63
US6998638B2Feb 14, 2006
Test structure for detecting bonding-induced cracks
LSI LOGIC CORP2 citations62
US6781150B2Aug 24, 2004
Test structure for detecting bonding-induced cracks
LSI LOGIC CORP4 citations62
US6861748B2Mar 1, 2005
Test structure
LSI LOGIC CORP2 citations60
US6486002B1Nov 26, 2002
Tape design to reduce warpage
LSI LOGIC CORP1 citations49
US6603200B1Aug 5, 2003
Integrated circuit package
LSI LOGIC CORP1 citations48
US6425179B1Jul 30, 2002
Method for assembling tape ball grid arrays
LSI LOGIC CORP0 citations42
LSI CORP
3 patentsUS7420809B2Sep 2, 2008
Heat spreader in integrated circuit package
LSI CORP33 citations91
US7235889B2Jun 26, 2007
Integrated heatspreader for use in wire bonded ball grid array semiconductor packages
LSI CORP6 citations61
US8350379B2Jan 8, 2013
Package with power and ground through via
LSI CORP4 citations60