Inventor · disambiguated record
Ronald Frank Kolc
Also filed as: KOLC RONALD F · KOLC RONALD FRANK
11 granted patents·1 pending application·1,855 citations·filing 1979–2003
95Inventor score
Top patents by PatentIndex Score
12 records- 0199US6614103B1Plastic packaging of LED arraysGEN ELECTRIC·Filed 2000·Granted Sep 2, 2003·331 cites·26 claims
- 0298US6733711B2Plastic packaging of LED arraysGEN ELECTRIC·Filed 2003·Granted May 11, 2004·208 cites·20 claims
- 0398US5527741AFabrication and structures of circuit modules with flexible interconnect layersMARTIN MARIETTA CORP·Filed 1994·Granted Jun 18, 1996·351 cites·13 claims
- 0497US6396153B2Circuit chip package and fabrication methodGEN ELECTRIC·Filed 2001·Granted May 28, 2002·163 cites·10 claims
- 0596US6242282B1Circuit chip package and fabrication methodGEN ELECTRIC·Filed 1999·Granted Jun 5, 2001·198 cites·20 claims
- 0696US6239482B1Integrated circuit package including window frameGEN ELECTRIC·Filed 1999·Granted May 29, 2001·217 cites·26 claims
- 0794US5857858ADemountable and repairable low pitch interconnect for stacked multichip modulesGEN ELECTRIC·Filed 1996·Granted Jan 12, 1999·170 cites·25 claims
- 0888US6507113B1Electronic interface structures and methods of fabricationGEN ELECTRIC·Filed 1999·Granted Jan 14, 2003·58 cites·17 claims
- 0987US6730533B2Plastic packaging of LED arraysGEN ELECTRIC·Filed 2003·Granted May 4, 2004·35 cites·24 claims
- 1087US6239980B1Multimodule interconnect structure and processGEN ELECTRIC·Filed 1998·Granted May 29, 2001·91 cites·41 claims
- 1179US4291642ANozzle for dispensing viscous fluidRCA CORP·Filed 1979·Granted Sep 29, 1981·33 cites·6 claims
- 1241US2003057515A1Methods of fabrication of electronic interface structuresFiled 2002·Application pending·0 cites
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