Inventor · disambiguated record
Chi-Jung Song
Also filed as: SONG CHI J · SONG CHI-JUNG
14 granted patents·2 pending applications·1,063 citations·filing 1994–2022
95Inventor score
Technology areasH10W
Files withLG SEMICON CO LTD5HYUNDAI ELECTRONICS IND4GOLD STAR ELECTRONICS3NEPES CO LTD2HYUNDAI ELECTROMICS IND CO LTD1
Top patents by PatentIndex Score
16 records- 0196US5444301ASemiconductor package and method for manufacturing the sameGOLD STAR ELECTRONICS·Filed 1994·Granted Aug 22, 1995·302 cites·8 claims
- 0295US5770888AIntegrated chip package with reduced dimensions and leads exposed from the top and bottom of the packageLG SEMICON CO LTD·Filed 1996·Granted Jun 23, 1998·261 cites·35 claims
- 0390US5554886ALead frame and semiconductor package with such lead frameGOLD STAR ELECTRONICS·Filed 1995·Granted Sep 10, 1996·122 cites·12 claims
- 0488US6441498B1Semiconductor substrate and land grid array semiconductor package using sameHYUNDAI ELECTRONICS IND·Filed 1998·Granted Aug 27, 2002·85 cites·23 claims
- 0582US6316837B1Area array type semiconductor package and fabrication methodHYUNDAI ELECTRONICS IND·Filed 1998·Granted Nov 13, 2001·58 cites·21 claims
- 0682US6031284APackage body and semiconductor chip package using sameLG SEMICON CO LTD·Filed 1998·Granted Feb 29, 2000·68 cites·31 claims
- 0779US8237276B2Bump structure and fabrication method thereofSONG CHI JUNG·Filed 2010·Granted Aug 7, 2012·8 cites·6 claims
- 0877US6484394B1Encapsulation method for ball grid array semiconductor packageHYUNDAI ELECTRONICS IND·Filed 2000·Granted Nov 26, 2002·30 cites·14 claims
- 0974US5471088ASemiconductor package and method for manufacturing the sameGOLD STAR ELECTRONICS·Filed 1995·Granted Nov 28, 1995·46 cites·10 claims
- 1069US5910682ASemiconductor chip stack packageLG SEMICON CO LTD·Filed 1997·Granted Jun 8, 1999·38 cites·19 claims
- 1164US6682957B2Semiconductor substrate and land grid array semiconductor package using same and fabrication methods thereofHYUNDAI ELECTROMICS IND CO LTD·Filed 2002·Granted Jan 27, 2004·11 cites·19 claims
- 1259US5834837ASemiconductor package having leads with step-shaped dimplesLG SEMICON CO LTD·Filed 1997·Granted Nov 10, 1998·24 cites·6 claims
- 1358US7122401B2Area array type semiconductor package fabrication methodHYUNDAI ELECTRONICS IND·Filed 2001·Granted Oct 17, 2006·7 cites·25 claims
- 1451US2022352059A1Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2022·Application pending·0 cites
- 1549US7491572B2Method for fabricating an image sensor mounted by mass reflowNEPES CO LTD·Filed 2004·Granted Feb 17, 2009·3 cites·23 claims
- 1633US2002148112A1Encapsulation method for ball grid array semiconductor packageLG SEMICON CO LTD·Filed 2002·Application pending·0 cites
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