Assignee
NEPES CO LTD
KR·28 granted patents·11 pending applications·89 citations·filing 2004–2025
Top patents by PatentIndex Score
39 records- 0194US9653397B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2015·Granted May 16, 2017·14 cites·12 claims
- 0293US9502391B2Semiconductor package, fabrication method therefor, and package-on packageNEPES CO LTD·Filed 2013·Granted Nov 22, 2016·21 cites·21 claims
- 0388US11011502B2Semiconductor packageNEPES CO LTD·Filed 2019·Granted May 18, 2021·6 cites·14 claims
- 0481US11545451B2Semiconductor packageNEPES CO LTD·Filed 2021·Granted Jan 3, 2023·1 cites·20 claims
- 0581US10957654B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2019·Granted Mar 23, 2021·5 cites·11 claims
- 0679US11476211B2Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2020·Granted Oct 18, 2022·1 cites·18 claims
- 0778US11948891B2Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2021·Granted Apr 2, 2024·1 cites·6 claims
- 0878US10804146B2Method for producing semiconductor packageNEPES CO LTD·Filed 2019·Granted Oct 13, 2020·2 cites·20 claims
- 0977US9564411B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2012·Granted Feb 7, 2017·7 cites·12 claims
- 1076US9754892B2Stacked semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2012·Granted Sep 5, 2017·4 cites·17 claims
- 1175US10381312B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2017·Granted Aug 13, 2019·2 cites·5 claims
- 1273US7170170B2Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor packageNEPES CO LTD·Filed 2004·Granted Jan 30, 2007·15 cites·24 claims
- 1372US10964656B2Semiconductor package and method of manufacturing sameNEPES CO LTD·Filed 2019·Granted Mar 30, 2021·2 cites·16 claims
- 1471US9793251B2Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2015·Granted Oct 17, 2017·2 cites·18 claims
- 1568US11276632B2Semiconductor packageNEPES CO LTD·Filed 2019·Granted Mar 15, 2022·2 cites·17 claims
- 1665US2026096458A1Semiconductor packageNEPES CO LTD·Filed 2025·Application pending·0 cites
- 1761US2024213187A1Semiconductor package and method for manufacturing the sameNEPES CO LTD·Filed 2023·Application pending·0 cites
- 1859US2024347434A1Package for semiconductorNEPES CO LTD·Filed 2024·Application pending·0 cites
- 1959US2026076127A1Semiconductor package and smiconductor package manufacturing methodNEPES CO LTD·Filed 2023·Application pending·0 cites
- 2055US2023216201A1Semiconductor package including antenna and method of manufacturing the semiconductor packageNEPES CO LTD·Filed 2022·Application pending·0 cites
- 2154US2025087617A1Semiconductor packageNEPES CO LTD·Filed 2023·Application pending·0 cites
- 2253US12494421B2Semiconductor package including redistribution structure, and method of manufacturing the sameNEPES CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·9 claims
- 2351US2022352059A1Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2022·Application pending·0 cites
- 2449US11404347B2Semiconductor packageNEPES CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·17 claims
- 2549US10410968B2Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2016·Granted Sep 10, 2019·1 cites·22 claims
- 2649US7491572B2Method for fabricating an image sensor mounted by mass reflowNEPES CO LTD·Filed 2004·Granted Feb 17, 2009·3 cites·23 claims
- 2747US11393768B2Semiconductor package and manufacturing method thereofNEPES CO LTD·Filed 2020·Granted Jul 19, 2022·0 cites·14 claims
- 2844US12525547B2Semiconductor package and method for manufacturing sameNEPES CO LTD·Filed 2020·Granted Jan 13, 2026·0 cites·3 claims
- 2943US12183704B2Semiconductor package and method for manufacturing the sameNEPES CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·6 claims
- 3043US12125775B2Semiconductor package and method for manufacturing the sameNEPES CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·12 claims
- 3142US12205904B2Wafer-level design and wiring pattern for a semiconductor packageNEPES CO LTD·Filed 2019·Granted Jan 21, 2025·0 cites·10 claims
- 3242US12198997B2Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficientsNEPES CO LTD·Filed 2019·Granted Jan 14, 2025·0 cites·13 claims
- 3340US2020273830A1Semiconductor device and method for manufacturing the sameNEPES CO LTD·Filed 2020·Application pending·0 cites
- 3439US11062990B2Semiconductor package of using insulating frameNEPES CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 3537US11264330B2Chip package with connection portion that passes through an encapsulation portionNEPES CO LTD·Filed 2018·Granted Mar 1, 2022·0 cites·16 claims
- 3635US2017069564A1Semiconductor package and method of manufacturing the sameNEPES CO LTD·Filed 2016·Application pending·0 cites
- 3734US11450535B2Manufacturing method for semiconductor package including filling member and membrane memberNEPES CO LTD·Filed 2017·Granted Sep 20, 2022·0 cites·4 claims
- 3834US2016293580A1System in package and method for manufacturing the sameNEPES CO LTD·Filed 2015·Application pending·0 cites
- 3925US2015287681A1Semiconductor package and method for manufacturing sameNEPES CO LTD·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →