Inventor · disambiguated record
Tsang-Jiuh Wu
Also filed as: WU TSANG-JIUH
98 granted patents·26 pending applications·818 citations·filing 1999–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD82TAIWAN SEMICONDUCTOR MFG24YU CHEN-HUA6CHANG HUNG-PIN2LIN YUNG-CHI2
Top patents by PatentIndex Score
124 records- 0198US8803316B2TSV structures and methods for forming the sameLIN YUNG-CHI·Filed 2011·Granted Aug 12, 2014·381 cites·20 claims
- 0297US11961800B2Via for semiconductor device connection and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 0397US11855021B2Semiconductor structure with through substrate vias and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 0497US11594420B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·3 cites·20 claims
- 0597US11487060B2Semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 1, 2022·5 cites·20 claims
- 0697US9748190B2Low cost and ultra-thin chip on wafer on substrate (CoWoS) formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·25 cites·21 claims
- 0797US8674513B2Interconnect structures for substrateYU CHEN-HUA·Filed 2010·Granted Mar 18, 2014·36 cites·17 claims
- 0896US12015008B2Wafer bonding methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 18, 2024·2 cites·20 claims
- 0995US11774675B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·2 cites·20 claims
- 1095US8466059B2Multi-layer interconnect structure for stacked diesCHANG HUNG-PIN·Filed 2010·Granted Jun 18, 2013·32 cites·19 claims
- 1193US11037904B2Singulation and bonding methods and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 15, 2021·6 cites·20 claims
- 1293US8956966B2TSV structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 17, 2015·11 cites·20 claims
- 1392US6720256B1Method of dual damascene patterningTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 13, 2004·78 cites·43 claims
- 1490US11437344B2Wafer bonding methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·2 cites·20 claims
- 1590US8580682B2Cost-effective TSV formationYANG KU-FENG·Filed 2010·Granted Nov 12, 2013·11 cites·18 claims
- 1690US8487410B2Through-silicon vias for semicondcutor substrate and method of manufactureYU CHEN-HUA·Filed 2011·Granted Jul 16, 2013·8 cites·9 claims
- 1789US8673775B2Methods of forming semiconductor structuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 18, 2014·8 cites·17 claims
- 1888US10867943B2Die structure, die stack structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·6 cites·20 claims
- 1988US9449898B2Semiconductor device having backside interconnect structure through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·6 cites·20 claims
- 2087US9786580B2Self-alignment for redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 10, 2017·8 cites·17 claims
- 2187US9252110B2Interconnect structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 2, 2016·6 cites·20 claims
- 2286US10290604B2Substrateless integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·4 cites·20 claims
- 2386US8803322B2Through substrate via structures and methods of forming the sameYANG KU-FENG·Filed 2011·Granted Aug 12, 2014·7 cites·20 claims
- 2485US10510641B2Semiconductor device having backside interconnect structure on through substrate via and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·3 cites·18 claims
- 2585US2025266325A1Semiconductor Device Having Backside Interconnect Structure on Through Substrate ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2685US2024395775A1Singulation and bonding methods and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2784US12374651B2Wafer bonding methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 2884US12322680B2Semiconductor device having backside interconnect structure on through substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 2984US11355475B2Singulation and bonding methods and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 7, 2022·2 cites·20 claims
- 3083US10622302B2Via for semiconductor device connection and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 14, 2020·2 cites·20 claims
- 3183US9263382B2Through substrate via structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·5 cites·20 claims
- 3283US9087878B2Device with through-silicon via (TSV) and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 21, 2015·5 cites·20 claims
- 3383US9006101B2Interconnect structure and methodCHEN HSIN-YU·Filed 2012·Granted Apr 14, 2015·6 cites·19 claims
- 3483US8841773B2Multi-layer interconnect structure for stacked diesCHANG HUNG-PIN·Filed 2012·Granted Sep 23, 2014·6 cites·20 claims
- 3583US2024250020A1Via for semiconductor device connectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3683US2025316644A1Wafer bonding methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3782US9842825B2Substrateless integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 12, 2017·5 cites·20 claims
- 3882US8525343B2Device with through-silicon via (TSV) and method of forming the sameYU CHEN-HUA·Filed 2010·Granted Sep 3, 2013·5 cites·21 claims
- 3981US12276838B2Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 4081US12142485B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 4181US2025357394A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4280US12159860B2Singulation and bonding methods and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 4380US2024387263A1Via for Component Electrode ConnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4480US2025216607A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4580US2024379374A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4680US2025327951A1Embedded lens structures and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4779US2024363411A1Tsv structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4879US2025364493A1Semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4979US2025357297A13dic with gap-fill structures and the method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5078US9112007B2Through via structure and methodLIN YUNG-CHI·Filed 2012·Granted Aug 18, 2015·3 cites·13 claims
Showing the top 50 of 124 patent records by PatentIndex Score.
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