Inventor · disambiguated record
Yeong Kwon Ko
Also filed as: KO YEONG KWON
7 granted patents·2 pending applications·156 citations·filing 2013–2024
84Inventor score
Top patents by PatentIndex Score
9 records- 0196US8816407B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 26, 2014·90 cites·20 claims
- 0294US10403603B2Semiconductor package and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 3, 2019·14 cites·19 claims
- 0394US9449930B2Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the sameKIM TAE-HYEONG·Filed 2015·Granted Sep 20, 2016·47 cites·17 claims
- 0477US11069541B2Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·20 claims
- 0573US2024379626A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0671US9893018B2Alignment mark for semiconductor deviceKO YEONG KWON·Filed 2015·Granted Feb 13, 2018·3 cites·18 claims
- 0766US12074141B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·13 claims
- 0856US2025046659A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0940US10804212B2Semiconductor device and package including modified region of less density at edge of device or substrateSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·16 claims
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