Inventor · disambiguated record
David Rodney Baker
Also filed as: BAKER DAVID R · BAKER DAVID RODNEY
8 granted patents·3 pending applications·89 citations·filing 1998–2018
86Inventor score
Top patents by PatentIndex Score
11 records- 0187US9680273B2Electrical connector with electrical contacts protected by a layer of compressible material and method of making itLIGHT DAVID NOEL·Filed 2013·Granted Jun 13, 2017·15 cites·15 claims
- 0278US10776600B2Electronic sensor supported on rigid substrateIDEX ASA·Filed 2018·Granted Sep 15, 2020·2 cites·20 claims
- 0376US10331934B2Electronic sensor supported on rigid substrateIDEX ASA·Filed 2016·Granted Jun 25, 2019·2 cites·25 claims
- 0474US6573459B2Graded metallic leads for connection to microelectronic elementsTESSERA INC·Filed 2002·Granted Jun 3, 2003·18 cites·11 claims
- 0558US6255723B1Layered lead structuresTESSERA INC·Filed 1998·Granted Jul 3, 2001·22 cites·64 claims
- 0655US6465744B2Graded metallic leads for connection to microelectronic elementsTESSERA INC·Filed 1999·Granted Oct 15, 2002·17 cites·37 claims
- 0752US10387707B2Reinforcement panel for fingerprint sensor coverIDEX ASA·Filed 2017·Granted Aug 20, 2019·0 cites·21 claims
- 0846US6248656B1Metal-jacketed lead manufacturing process using resist layersTESSERA INC·Filed 1999·Granted Jun 19, 2001·13 cites·25 claims
- 0940US2008105963A1Stackable electronic device assemblyTESSERA INC·Filed 2007·Application pending·0 cites
- 1039US2007246820A1Die protection processTESSERA INC·Filed 2006·Application pending·0 cites
- 1130US2018358770A1Electrical Connector with Electrical Contacts Protected by a Layer of Compressible Material and Method of Making ItLIGHT DAVID NOEL·Filed 2017·Application pending·0 cites
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