Inventor · disambiguated record
Sankuei Lin
Also filed as: LIN SANKUEI
7 granted patents·2 pending applications·8 citations·filing 2016–2022
75Inventor score
Files withAPPLIED MATERIALS INC9
Top patents by PatentIndex Score
9 records- 0183US9685374B1Contact process flowAPPLIED MATERIALS INC·Filed 2016·Granted Jun 20, 2017·5 cites·20 claims
- 0282US11211286B2Airgap formation processesAPPLIED MATERIALS INC·Filed 2019·Granted Dec 28, 2021·3 cites·16 claims
- 0366US12142534B2Replacement contact processAPPLIED MATERIALS INC·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 0465US12170230B2Methods of forming bottom dielectric isolation layersAPPLIED MATERIALS INC·Filed 2021·Granted Dec 17, 2024·0 cites·15 claims
- 0565US11735467B2Airgap formation processesAPPLIED MATERIALS INC·Filed 2021·Granted Aug 22, 2023·0 cites·3 claims
- 0662US12230691B2Three dimensional device formation using early removal of sacrificial heterostructure layerAPPLIED MATERIALS INC·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 0753US10943834B2Replacement contact processAPPLIED MATERIALS INC·Filed 2018·Granted Mar 9, 2021·0 cites·10 claims
- 0850US2022359208A1Process integration to reduce contact resistance in semiconductor deviceAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0947US2024055269A1Dry etch for nitride exhume processes in 3d nand fabricationAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →