Inventor
LEE SHENG-YUAN
TW75 patents
⚠️ This page may combine multiple inventors who share the name “LEE SHENG-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VIA TECH INC
36 patentsUS7382219B1Jun 3, 2008
Inductor structure
VIA TECH INC25 citations93
US7339452B2Mar 4, 2008
Embedded inductor and application thereof
VIA TECH INC20 citations93
US7317354B2Jan 8, 2008
Inductor
VIA TECH INC40 citations93
US7312685B1Dec 25, 2007
Symmetrical inductor
VIA TECH INC23 citations93
US7202548B2Apr 10, 2007
Embedded capacitor with interdigitated structure
VIA TECH INC38 citations93
US7129568B2Oct 31, 2006
Chip package and electrical connection structure between chip and substrate
VIA TECH INC25 citations93
US7087993B2Aug 8, 2006
Chip package and electrical connection structure between chip and substrate
VIA TECH INC25 citations93
US7705704B2Apr 27, 2010
Inductor structure
VIA TECH INC21 citations92
US7671282B2Mar 2, 2010
Structure of a circuit board for improving the performance of routing traces
VIA TECH INC16 citations84
US7633368B2Dec 15, 2009
On-chip inductor
VIA TECH INC13 citations84
US7626480B2Dec 1, 2009
Spiral inductor with multi-trace structure
VIA TECH INC14 citations84
US7598836B2Oct 6, 2009
Multilayer winding inductor
VIA TECH INC19 citations84
US7504922B2Mar 17, 2009
Embedded inductor element and chip package applying the same
VIA TECH INC8 citations84
US7312683B1Dec 25, 2007
Symmetrical inductor
VIA TECH INC10 citations84
US7030490B2Apr 18, 2006
Structure of multi-tier wire bonding for high frequency integrated circuit
VIA TECH INC13 citations84
US7663463B2Feb 16, 2010
Inductor structure
VIA TECH INC10 citations83
US7504923B1Mar 17, 2009
Inductor structure
VIA TECH INC9 citations83
US7420452B1Sep 2, 2008
Inductor structure
VIA TECH INC19 citations83
US7443272B2Oct 28, 2008
Signal transmission structure, circuit board and connector assembly structure
VIA TECH INC13 citations82
US9443843B2Sep 13, 2016
Integrated circuit device
VIA TECH INC8 citations80
US7489218B2Feb 10, 2009
Inductor structure
VIA TECH INC7 citations74
US7215226B2May 8, 2007
Skew-symmetrical defected ground structure for parallel-coupled line filters
VIA TECH INC6 citations74
US10468830B2Nov 5, 2019
Paddle card and plug-cable assembly
VIA TECH INC4 citations73
US10218127B2Feb 26, 2019
Paddle card and plug-cable assembly
VIA TECH INC3 citations73
US9991327B2Jun 5, 2018
Semiconductor device having inductor
VIA TECH INC2 citations73
US9443842B2Sep 13, 2016
Integrated circuit device
VIA TECH INC3 citations69
US9210800B1Dec 8, 2015
Circuit layout structure, circuit board and electronic assembly
VIA TECH INC3 citations63
US8022805B2Sep 20, 2011
Spiral inductor device
VIA TECH INC5 citations63
US7750784B2Jul 6, 2010
Inductor structure
VIA TECH INC2 citations63
US7709745B2May 4, 2010
Circuit board with plating bar
VIA TECH INC3 citations63
US7642890B2Jan 5, 2010
Inductor structure
VIA TECH INC3 citations63
US7420451B2Sep 2, 2008
Symmetrical differential inductor
VIA TECH INC5 citations63
US7361981B2Apr 22, 2008
Pad layout
VIA TECH INC2 citations63
US7274271B2Sep 25, 2007
Signal transmission structure having alignment hole for coaxial cable connector
VIA TECH INC5 citations63
US7091803B2Aug 15, 2006
Signal transmission structure
VIA TECH INC3 citations63
US7477125B1Jan 13, 2009
Symmetrical inductor device
VIA TECH INC4 citations62
LEE SHENG-YUAN
9 patentsUS8552308B2Oct 8, 2013
Differential signal pair transmission structure, wiring board and electronic module
LEE SHENG-YUAN7 citations84
US8303315B2Nov 6, 2012
Electrical connector and electronic assembly having a lead arrangement
LEE SHENG-YUAN11 citations84
US8253523B2Aug 28, 2012
Spiral inductor device
LEE SHENG-YUAN9 citations84
US8083546B2Dec 27, 2011
Electric connector and electric assembly
LEE SHENG-YUAN16 citations84
US8081056B2Dec 20, 2011
Spiral inductor
LEE SHENG-YUAN11 citations83
US8740651B2Jun 3, 2014
Lead arrangement, electric connector and electric assembly
LEE SHENG-YUAN5 citations73
US8476747B2Jul 2, 2013
Leadframe, leadframe type package and lead lane
LEE SHENG-YUAN2 citations63
US8084848B2Dec 27, 2011
Leadframe, leadframe type package and lead lane
LEE SHENG-YUAN2 citations63
US8135974B2Mar 13, 2012
Power on control device and method
LEE SHENG-YUAN3 citations61
VIA LABS INC
3 patentsVALUE TECHNOLOGY INC
2 patentsShowing the top 50 of 75 patents by PatentIndex Score.