Signal transmission structure having alignment hole for coaxial cable connector

Abstract

A signal transmission structure is provided. The signal transmission structure includes a circuit board, a coaxial cable connector, and a conductive layer; the aforementioned circuit board includes at least one alignment through hole, a signal pad, and a signal trace connected to the signal pad. Additionally, the signal pad and the signal trace are disposed on a surface of the circuit board. In addition, the alignment through hole passes through the circuit board. The coaxial cable connector is located on a surface of the circuit board. The coaxial cable connector has a signal pin and at least an alignment pin, and the alignment pin is inserted into the alignment through hole. The conductive layer is located between one end of the signal pin and the signal pad, and the signal pin is electrically connected to the signal pad via the conductive layer.

1. A signal transmission structure, comprising:
 a circuit board, having at least one alignment through hole, a signal pad, and a signal trace connected to the signal pad, wherein the signal pad and the signal trace are disposed on a surface of the circuit board, and the at least one alignment through hole passes through the circuit board; 
 a coaxial cable connector, disposed on the surface of the circuit board, the coaxial cable connector comprising a signal pin and at least one alignment pin, wherein the at least one alignment pin is inserted into the at least one alignment through hole; and 
 a conductive layer, disposed between one end of the signal pin and the signal pad, the signal pin being electrically connected to the signal pad via the conductive layer. 
 
   
   
     2. The signal transmission structure as claimed in  claim 1 , wherein the circuit board further comprises at least one alignment hole pad on the surface, and the at least one alignment pin is inserted into the at least one alignment through hole and passes through the at least one alignment hole pad. 
   
   
     3. The signal transmission structure as claimed in  claim 2 , wherein the circuit board further comprises an internal reference plane, and the alignment pin is connected to the internal reference plane. 
   
   
     4. The signal transmission structure as claimed in  claim 3 , wherein the internal reference plane is a ground plane or a power plane. 
   
   
     5. The signal transmission structure as claimed in  claim 1 , wherein a material of the conductive layer comprises solder. 
   
   
     6. The signal transmission structure as claimed in  claim 1 , wherein a material of the conductive layer comprises conductive paste. 
   
   
     7. The signal transmission structure as claimed in  claim 1 , wherein an outer diameter of the signal pin is larger than a width of the signal trace. 
   
   
     8. The signal transmission structure as claimed in  claim 7 , wherein an outer diameter of the signal pin is larger than an outer diameter of the signal pad. 
   
   
     9. A signal transmission structure, comprising:
 a circuit board, comprising at least one ground plane, at least one ground through hole electrically connected to the ground plane, a signal pad, and a signal trace connected to the signal pad, wherein the signal pad and the signal trace are disposed on a surface of the circuit board, and the ground through hole passes through the circuit board, 
 a coaxial cable connector, disposed on the surface of the circuit board, the coaxial cable connector comprising a signal pin and at least one ground pin, wherein the at least one ground pin is inserted into the at least one ground through hole; and 
 a conductive layer, disposed between one end of the signal pin and the signal pad, wherein the signal pin is electrically connected to the signal pad via the conductive layer. 
 
   
   
     10. The signal transmission structure as claimed in  claim 9 , wherein the circuit board further comprises at least one ground hole pad on the surface thereof, and the at least one ground pin is inserted into the at least one ground through hole and passes through the at least one ground hole pad. 
   
   
     11. The signal transmission structure as claimed in  claim 9 , wherein a material of the conductive layer comprises solder. 
   
   
     12. The signal transmission structure as claimed in  claim 9 , wherein a material of the conductive layer comprises conductive paste. 
   
   
     13. The signal transmission structure as claimed in  claim 9 , wherein an outer diameter of the signal pin is larger than a width of the signal trace. 
   
   
     14. The signal transmission structure as claimed in  claim 9 , wherein an outer diameter of the signal pin is larger than an outer diameter of the signal pad.