Inventor
TSAI YAO-JUN
TW26 patents
⚠️ This page may combine multiple inventors who share the name “TSAI YAO-JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
19 patentsUS9847047B2Dec 19, 2017
Display pixel with redundant element and display panel
IND TECH RES INST21 citations94
US9171779B2Oct 27, 2015
Semiconductor laser structure
IND TECH RES INST16 citations92
US9425359B2Aug 23, 2016
Light emitting diode
IND TECH RES INST20 citations89
US7883910B2Feb 8, 2011
Light emitting diode structure, LED packaging structure using the same and method of forming the same
IND TECH RES INST12 citations84
US10134709B1Nov 20, 2018
Substrateless light emitting diode (LED) package for size shrinking and increased resolution of display device
IND TECH RES INST15 citations82
US9391239B2Jul 12, 2016
Light emitting diode
IND TECH RES INST3 citations71
US9548424B2Jan 17, 2017
Light emitting diode
IND TECH RES INST4 citations70
US12230170B2Feb 18, 2025
Display panel applied to large size or high pixel density tiling display
IND TECH RES INST0 citations62
US11817054B2Nov 14, 2023
Pixel structure having repairing light emitting diode die and extending conductor and display having pixel structure
IND TECH RES INST0 citations62
US11443692B2Sep 13, 2022
Pixel structure having repairing light emitting diode die and extending conductor, manufacturing method of pixel structure, and display having pixel structure
IND TECH RES INST0 citations62
US9653382B2May 16, 2017
Semiconductor laser structure
IND TECH RES INST1 citations62
US7923746B2Apr 12, 2011
Light emitting diode package structure and method for fabricating the same
IND TECH RES INST3 citations62
US11996498B2May 28, 2024
Subpixel structure having light shielding layer, pixel structure having light shielding layer, and light emitting diode chip light shielding layer
IND TECH RES INST0 citations52
US11502232B2Nov 15, 2022
Pixel structure
IND TECH RES INST0 citations52
US12199215B2Jan 14, 2025
Light-emitting device and display apparatus
IND TECH RES INST0 citations51
US11227787B2Jan 18, 2022
Transfer support and transfer module
IND TECH RES INST0 citations51
US10431483B2Oct 1, 2019
Transfer support and transfer module
IND TECH RES INST0 citations51
US8349627B2Jan 8, 2013
Method for fabricating a light emitting diode package structure
IND TECH RES INST0 citations51
US9252079B2Feb 2, 2016
Substrate, method of fabricating the same, and application the same
IND TECH RES INST0 citations50
TSAI YAO-JUN
5 patentsUS8193541B2Jun 5, 2012
Light emitting diode structure having a conductive thin film for connecting a light emitting stack to an electrode and LED packaging structure using the same
TSAI YAO-JUN8 citations83
US9178107B2Nov 3, 2015
Wafer-level light emitting diode structure, light emitting diode chip, and method for forming the same
TSAI YAO-JUN15 citations82
US8759865B2Jun 24, 2014
Light emitting diode chip, light emitting diode package structure, and method for forming the same
TSAI YAO-JUN13 citations82
US8115218B2Feb 14, 2012
Light emitting diode package structure and method for fabricating the same
TSAI YAO-JUN6 citations72
US8138518B2Mar 20, 2012
Light emitting diode, package structure and manufacturing method thereof
TSAI YAO-JUN4 citations62