Inventor
NAKAYAMA HIDEKAZU
JP17 patents
⚠️ This page may combine multiple inventors who share the name “NAKAYAMA HIDEKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LINTEC CORP
15 patentsUS10266734B2Apr 23, 2019
Curable composition, cured product, method for using curable composition, and optical device
LINTEC CORP2 citations71
US12288768B2Apr 29, 2025
Method of manufacturing laminate
LINTEC CORP0 citations61
US11948865B2Apr 2, 2024
Film-shaped firing material and film-shaped firing material with a support sheet
LINTEC CORP0 citations61
US11267992B2Mar 8, 2022
Film-shaped firing material and film-shaped firing material with support sheet
LINTEC CORP0 citations61
US12406960B2Sep 2, 2025
Method of manufacturing laminate by sinter- bonding semiconductor chip and substrate
LINTEC CORP0 citations51
US11420255B2Aug 23, 2022
Film-shaped firing material and film-shaped firing material with a support sheet
LINTEC CORP0 citations50
US11285536B2Mar 29, 2022
Film-shaped fired material, and film-shaped fired material with support sheet
LINTEC CORP0 citations50
US10745559B2Aug 18, 2020
Curable composition, method for producing curable composition, cured product, and use of curable composition
LINTEC CORP0 citations50
US10294398B2May 21, 2019
Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device
LINTEC CORP0 citations50
US9963624B2May 8, 2018
Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device
LINTEC CORP0 citations50
US10920117B2Feb 16, 2021
Curable composition, method for producing curable composition, cured product, use of curable composition, and optical device
LINTEC CORP0 citations47
US11219946B2Jan 11, 2022
Firing material composition, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material with support sheet
LINTEC CORP0 citations46
US11315899B2Apr 26, 2022
Die bonding material, light-emitting device, and method for producing light-emitting device
LINTEC CORP0 citations45
US10308850B2Jun 4, 2019
Curable composition, method for manufacturing curable composition, cured product, method for using curable composition, and optical device
LINTEC CORP0 citations45
US10774249B2Sep 15, 2020
Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device
LINTEC CORP0 citations39