Inventor
LI CHAO-WEI
TW23 patents
⚠️ This page may combine multiple inventors who share the name “LI CHAO-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
7 patentsUS12368086B2Jul 22, 2025
Package structure having thermoelectric cooler
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12512419B2Dec 30, 2025
Method of fabricating memory device and package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12218082B2Feb 4, 2025
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11855006B2Dec 26, 2023
Memory device, package structure and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12438007B2Oct 7, 2025
Staggered metal mesh on backside of device die and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12354997B2Jul 8, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12354929B2Jul 8, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
LI CHAO-WEI
4 patentsUS8926130B2Jan 6, 2015
Illumination device and assembling method thereof
LI CHAO-WEI7 citations82
USD685508SJul 2, 2013
Light emitting diode lamp
LI CHAO-WEI0 citations50
US8178890B2May 15, 2012
Light emitting diode package structure
LI CHAO-WEI0 citations45
US8692274B2Apr 8, 2014
Light emitting diode package structure
LI CHAO-WEI0 citations39
IND TECH RES INST
4 patentsUS7923746B2Apr 12, 2011
Light emitting diode package structure and method for fabricating the same
IND TECH RES INST3 citations62
US8349627B2Jan 8, 2013
Method for fabricating a light emitting diode package structure
IND TECH RES INST0 citations51
US9052418B2Jun 9, 2015
Light source module
IND TECH RES INST0 citations50
US8979313B2Mar 17, 2015
Semiconductor light source device
IND TECH RES INST0 citations41