Inventor

CHOI BOK KYU

KR30 patents

⚠️ This page may combine multiple inventors who share the name “CHOI BOK KYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOI BOK KYU

SK HYNIX INC

Semiconductor packages including bridge die

Storage system including a decoupling device having a plurality of unit capacitors

Semiconductor package including stacked semiconductor chips

Storage system including a decoupling device having a plurality of unit capacitors

Stack packages with interposer bridge

Stack packages including an interconnection structure

Semiconductor packages including stacked sub-packages with interposing bridges

Semiconductor packages including modules stacked with interposing bridges

Semiconductor package including stacked semiconductor chips

Storage system including a decoupling device having a plurality of unit capacitors

Stack package including core die stacked over a controller die

Semiconductor package

Stack package including core die stacked over a controller die

Stacked semiconductor package having heat dissipation structure

Semiconductor packages including a bridge die

Semiconductor chip including penetrating electrodes, and semiconductor package including the semiconductor chip

Semiconductor package including stacked semiconductor chips

Stack packages including vertically stacked sub-packages with interposer bridges

Stack packages including through mold via structures

Semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semiconductor packages

Semiconductor packages having EMI shielding layers

Package substrate with band stop filter and semiconductor package including the same

Semiconductor packages including stack modules comprised of interposing bridges and semiconductor dies

Stack packages including through mold vias

HYNIX SEMICONDUCTOR INC

Circuit board having conductive shield member and semiconductor package using the same

Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor package

LG CHEMICAL LTD

Method for prelithiation, method for fabricating lithium secondary battery comprising the method, and lithium secondary battery fabricated from the fabricating method

Electrode for electrochemical device with low resistance, method for manufacturing the same, and electrochemical device comprising the electrode

CHOI BOK KYU

Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor package

Circuit board having conductive shield member and semiconductor package using the same