Inventor

YAMANO TAKAHARU

JP57 patents

⚠️ This page may combine multiple inventors who share the name “YAMANO TAKAHARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YAMANO TAKAHARU

SHINKO ELECTRIC IND CO

Chip embedded substrate and method of producing the same

Wiring board and method of manufacturing the same

Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same

Wiring board and method for manufacturing the same

Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side

Semiconductor device and method of fabricating the same

Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same

Laminated semiconductor package

Electronic parts packaging structure

Substrate with built-in electronic component and method for manufacturing the same

Method of manufacturing wiring board

Method of manufacturing a stacked semiconductor apparatus

Manufacturing method of chip integrated substrate

Wiring board manufacturing method

Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same

Method of manufacturing semiconductor device

Method for forming wiring on insulating resin layer

Semiconductor package

Semiconductor package with a conductive post and wiring pattern

Method of manufacturing semiconductor device and support structure for semiconductor substrate

Semiconductor device and semiconductor device array

Manufacturing method of substrate with through electrode

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Electronic device manufacturing method and electronic device

Semiconductor device and manufacturing method therefor

Through electrode and method for forming the same

Method of fabricating a built-in chip type substrate

Electronic part embedded substrate and method of producing an electronic part embedded substrate

Electronic part embedded substrate and method of producing an electronic part embedded substrate

Chip embedded substrate and method of producing the same

Method of manufacturing semiconductor device

Plating method

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing semiconductor device

Manufacturing method for semiconductor device embedded substrate

YAMANO TAKAHARU

Chip embedded substrate and method of producing the same

Semiconductor package and stacked layer type semiconductor package

Semiconductor device having a multilayer structure

Semiconductor device with reinforcement plate and method of forming same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method therefor

Semiconductor device, semiconductor package, method for manufacturing semiconductor device, and method for manufacturing semiconductor package

Electronic device manufacturing method and electronic device

Semiconductor device and method of manufacturing the same

SUNOHARA MASAHIRO

Wiring board and method of manufacturing the same

KOBAYASHI TOSHIO

Semiconductor-device mounted board and method of manufacturing the same

HARAYAMA YOICHI

Manufacturing method of preparing a substrate with forming and removing the check patterns in scribing regions before dicing to form semiconductor device

GOMYO TOSHIO

Method of manufacturing an electronic parts packaging structure