Method of fabricating a built-in chip type substrate

Abstract

A method of fabricating a built-in chip type substrate containing a semiconductor chip is disclosed. The method comprises a first step of mounting the semiconductor chip on a substrate; a second step of forming chip connection wiring connected to the semiconductor chip mounted on the substrate; and a step of forming an alignment post on the substrate before the first step, the alignment post being used for positioning the chip connection wiring.

1. A method of fabricating a built-in chip type substrate containing a semiconductor chip comprising:
 forming an alignment post on a substrate having substantially planar surface without holes therethrough; 
 mounting the semiconductor chip on a predetermined surface of the substrate; and 
 forming a chip connection wiring connected to the semiconductor chip mounted on the substrate surface, wherein the alignment post is used for positioning the chip connection wiring,
 wherein the built-in chip type substrate is comprised of the semiconductor chip mounted on the substrate. 
 
 
     
     
       2. The method of fabricating a built-in chip type substrate as claimed in  claim 1 , wherein the alignment post is used for positioning stepper exposure of resist that patterns the chip connection wiring. 
     
     
       3. The method of fabricating a built-in chip type substrate as claimed in  claim 1 , wherein the chip connection wiring is formed on an insulation layer formed on the semiconductor chip. 
     
     
       4. The method of fabricating a built-in chip type substrate as claimed in  claim 1 , wherein the alignment post is used for positioning the semiconductor chip to be mounted on the substrate. 
     
     
       5. The method of fabricating a built-in chip type substrate as claimed in  claim 1 , wherein the alignment post is formed by Cu plating.