Inventor
FRIEDRICH LAWRENCE WILLIAM
US3 patents
Patents
3 patentsUS6307388B1Oct 23, 2001
Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed together
UNISYS CORP17 citations82
US6196299B1Mar 6, 2001
Mechanical assembly for regulating the temperature of an electronic device which incorporates a heat exchanger that contacts an entire planar face on the device except for its corners
UNISYS CORP17 citations82
US6522156B2Feb 18, 2003
Planar subassembly for testing IC chips having faces with pressed electrical contacts that carry all power and signals for the chips
UNISYS CORP19 citations81