Planar subassembly for testing IC chips having faces with pressed electrical contacts that carry all power and signals for the chips
Abstract
An electromechanical apparatus for testing IC chips includes a chip holding subassembly, a power converter subassembly, and a temperature regulating subassembly which are squeezed together in multiple sets by respective pressing mechanisms; and this apparatus uses a generic structure for both the chip holding subassembly and the power converter subassembly. This generic structure is comprised of a planer substrate having first and second faces that are opposite to each other and are surrounded by an edge that is free of any electrical edge connectors. To use the above generic subassembly as the chip holding subassembly, an electrical components on the first face of the substrate include sockets which hold the chips that are tested. To use the above generic subassembly as the power converter subassembly, the electrical components on the first face of the substrate include electrical power converters for the chips that are tested.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A subassembly of an electromechanical apparatus for testing integrated circuit chips; said subassembly being comprised of:
first and second planar printed circuit boards, with each printed circuit board having first and second faces that are opposite to each other and are surrounded by an edge that is free of any electrical edge connectors;
a plurality of sockets, which are physically located on said first face of said printed circuit board, for holding said integrated circuit chips;
a first plurality of electrical contacts, which are physically located on said second face of said first printed circuit board and are connected through said first printed circuit board to said sockets, for carrying all electrical power and all electrical signals for said integrated circuit chips;
a plurality of electrical power converters and a signal connector, which are physically located on said first face of said second printed circuit board;
a second plurality of electrical contacts, which are physically located on said second face of said second printed circuit board and are connected through said second printed circuit board to said electrical power converters and said signal connector, for making pressed connections with said first plurality of electrical contacts; and,
a means for pressing said first and second printed circuit boards together such that said first and second plurality of electrical contacts make said pressed connections and power for said chips only travels from said electrical power converters on said second printed circuit board through said pressed connections to said sockets on said first printed circuit board.
2. A subassembly according to claim 1 wherein said power converters change DC power at one voltage to DC power at another voltage.
3. A subassembly according to claim 1 wherein said power converters change AC power to DC power.
4. A subassembly according to claim 1 wherein a plurality of spacers are also attached to said first face of said first printed circuit board between said sockets.
5. A subassembly according to claim 4 wherein said spacers are attached to said first face of said first printed circuit board in a removable fashion and have several selectable lengths.
6. A subassembly according to claim 1 wherein said first printed circuit board is an epoxy glass printed circuit board.
7. A subassembly according to claim 1 wherein said second printed circuit board is an epoxy glass printed circuit board.
8. A subassembly according to claim 1 wherein said first plurality of electrical contacts are springy contacts and said second plurality of electrical contacts are non-springy metal pads.
9. A subassembly according to claim 1 wherein said first plurality of electrical contacts are non-springy metal pads and said second plurality of electrical contacts are springy contacts.Cited by (0)
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