Inventor
CHONG YUNG FU
SG46 patents
⚠️ This page may combine multiple inventors who share the name “CHONG YUNG FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
20 patentsUS7718500B2May 18, 2010
Formation of raised source/drain structures in NFET with embedded SiGe in PFET
CHARTERED SEMICONDUCTOR MFG53 citations97
US6391731B1May 21, 2002
Activating source and drain junctions and extensions using a single laser anneal
CHARTERED SEMICONDUCTOR MFG59 citations96
US6365446B1Apr 2, 2002
Formation of silicided ultra-shallow junctions using implant through metal technology and laser annealing process
CHARTERED SEMICONDUCTOR MFG55 citations96
US7572712B2Aug 11, 2009
Method to form selective strained Si using lateral epitaxy
CHARTERED SEMICONDUCTOR MFG19 citations93
US7442618B2Oct 28, 2008
Method to engineer etch profiles in Si substrate for advanced semiconductor devices
CHARTERED SEMICONDUCTOR MFG22 citations92
US7413961B2Aug 19, 2008
Method of fabricating a transistor structure
CHARTERED SEMICONDUCTOR MFG22 citations92
US7405131B2Jul 29, 2008
Method and structure to prevent silicide strapping of source/drain to body in semiconductor devices with source/drain stressor
CHARTERED SEMICONDUCTOR MFG45 citations92
US6624489B2Sep 23, 2003
Formation of silicided shallow junctions using implant through metal technology and laser annealing process
CHARTERED SEMICONDUCTOR MFG25 citations92
US6534390B1Mar 18, 2003
Salicide method for producing a semiconductor device using silicon/amorphous silicon/metal structure
CHARTERED SEMICONDUCTOR MFG21 citations92
US6387784B1May 14, 2002
Method to reduce polysilicon depletion in MOS transistors
CHARTERED SEMICONDUCTOR MFG22 citations92
US6335253B1Jan 1, 2002
Method to form MOS transistors with shallow junctions using laser annealing
CHARTERED SEMICONDUCTOR MFG49 citations91
US6566650B1May 20, 2003
Incorporation of dielectric layer onto SThM tips for direct thermal analysis
CHARTERED SEMICONDUCTOR MFG25 citations89
US7256112B2Aug 14, 2007
Laser activation of implanted contact plug for memory bitline fabrication
CHARTERED SEMICONDUCTOR MFG15 citations84
US6734072B1May 11, 2004
Method of fabricating a MOSFET device using a spike rapid thermal oxidation procedure
CHARTERED SEMICONDUCTOR MFG9 citations74
US6566215B1May 20, 2003
Method of fabricating short channel MOS transistors with source/drain extensions
CHARTERED SEMICONDUCTOR MFG12 citations74
US7692213B2Apr 6, 2010
Integrated circuit system employing a condensation process
CHARTERED SEMICONDUCTOR MFG6 citations72
US6727151B2Apr 27, 2004
Method to fabricate elevated source/drain structures in MOS transistors
CHARTERED SEMICONDUCTOR MFG3 citations63
US7772071B2Aug 10, 2010
Strained channel transistor and method of fabrication thereof
CHARTERED SEMICONDUCTOR MFG2 citations62
US7645687B2Jan 12, 2010
Method to fabricate variable work function gates for FUSI devices
CHARTERED SEMICONDUCTOR MFG5 citations56
US7326609B2Feb 5, 2008
Semiconductor device and fabrication method
CHARTERED SEMICONDUCTOR MFG0 citations52
GLOBALFOUNDRIES SG PTE LTD
12 patentsUS8017487B2Sep 13, 2011
Method to control source/drain stressor profiles for stress engineering
GLOBALFOUNDRIES SG PTE LTD37 citations92
US7972921B2Jul 5, 2011
Integrated circuit isolation system
GLOBALFOUNDRIES SG PTE LTD3 citations63
US12142673B2Nov 12, 2024
Transistor with wrap-around extrinsic base
GLOBALFOUNDRIES SG PTE LTD0 citations62
US11855195B2Dec 26, 2023
Transistor with wrap-around extrinsic base
GLOBALFOUNDRIES SG PTE LTD0 citations62
US11855196B2Dec 26, 2023
Transistor with wrap-around extrinsic base
GLOBALFOUNDRIES SG PTE LTD0 citations62
US7892905B2Feb 22, 2011
Formation of strained Si channel and Si1-xGex source/drain structures using laser annealing
GLOBALFOUNDRIES SG PTE LTD2 citations60
US12564029B2Feb 24, 2026
Contact via structures of semiconductor devices
GLOBALFOUNDRIES SG PTE LTD0 citations59
US11776844B2Oct 3, 2023
Contact via structures of semiconductor devices
GLOBALFOUNDRIES SG PTE LTD0 citations59
US12500119B2Dec 16, 2025
Air gap with inverted T-shaped lower portion extending through at least one metal layer, and related method
GLOBALFOUNDRIES SG PTE LTD0 citations54
US9390962B1Jul 12, 2016
Methods for fabricating device substrates and integrated circuits
GLOBALFOUNDRIES SG PTE LTD1 citations42
US10395987B2Aug 27, 2019
Transistor with source-drain silicide pullback
GLOBALFOUNDRIES SG PTE LTD0 citations40
US10566441B2Feb 18, 2020
Methods of forming integrated circuits with solutions to interlayer dielectric void formation between gate structures
GLOBALFOUNDRIES SG PTE LTD0 citations34
IBM
4 patentsUS7482656B2Jan 27, 2009
Method and structure to form self-aligned selective-SOI
IBM15 citations84
US7442619B2Oct 28, 2008
Method of forming substantially L-shaped silicide contact for a semiconductor device
IBM9 citations84
US7566609B2Jul 28, 2009
Method of manufacturing a semiconductor structure
IBM6 citations63
US7595233B2Sep 29, 2009
Gate stress engineering for MOSFET
IBM0 citations52
CHONG YUNG FU
3 patentsUS8450775B2May 28, 2013
Method to control source/drain stressor profiles for stress engineering
CHONG YUNG FU18 citations91
US8288825B2Oct 16, 2012
Formation of raised source/drain structures in NFET with embedded SiGe in PFET
CHONG YUNG FU13 citations82
US8912567B2Dec 16, 2014
Strained channel transistor and method of fabrication thereof
CHONG YUNG FU2 citations61