Inventor
PARK SANG-KYUN
KR34 patents
⚠️ This page may combine multiple inventors who share the name “PARK SANG-KYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS7248527B2Jul 24, 2007
Self refresh period control circuits
SAMSUNG ELECTRONICS CO LTD60 citations98
US6928293B2Aug 9, 2005
Apparatus and method for receiving quick paging message in mobile station
SAMSUNG ELECTRONICS CO LTD20 citations92
US7606982B2Oct 20, 2009
Multi-path accessible semiconductor memory device having data transmission mode between ports
SAMSUNG ELECTRONICS CO LTD11 citations84
US7355912B2Apr 8, 2008
Auto-precharge control circuit in semiconductor memory and method thereof
SAMSUNG ELECTRONICS CO LTD15 citations84
US7307910B2Dec 11, 2007
Redundancy program circuit and methods thereof
SAMSUNG ELECTRONICS CO LTD10 citations83
US7477565B2Jan 13, 2009
Redundancy program circuit and methods thereof
SAMSUNG ELECTRONICS CO LTD4 citations73
US7940116B2May 10, 2011
Fuse circuit and semiconductor device including the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7692995B2Apr 6, 2010
Redundancy program circuit and methods thereof
SAMSUNG ELECTRONICS CO LTD1 citations62
US7606090B2Oct 20, 2009
Redundancy program circuit and methods thereof
SAMSUNG ELECTRONICS CO LTD2 citations62
US7984261B2Jul 19, 2011
Memory expansion structure in multi-path accessible semiconductor memory device
SAMSUNG ELECTRONICS CO LTD4 citations61
US8027675B2Sep 27, 2011
Apparatus and method for controlling registration of mobile identification number of mobile communication terminals
SAMSUNG ELECTRONICS CO LTD0 citations52
US8379477B2Feb 19, 2013
Sub-word-line driving circuit, semiconductor memory device having the same, and method of controlling the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US7609580B2Oct 27, 2009
Redundancy program circuit and methods thereof
SAMSUNG ELECTRONICS CO LTD0 citations51
MICRON TECHNOLOGY INC
8 patentsUS10795759B2Oct 6, 2020
Apparatuses and methods for error correction coding and data bus inversion for semiconductor memories
MICRON TECHNOLOGY INC2 citations73
US12412619B2Sep 9, 2025
Apparatuses and methods for row decoder with multiple section enable signal voltage domains
MICRON TECHNOLOGY INC0 citations62
US11367476B2Jun 21, 2022
Bit line equalization driver circuits and related apparatuses, methods, and computing systems to avoid degradation of pull-down transistors
MICRON TECHNOLOGY INC0 citations62
US11314591B2Apr 26, 2022
Apparatuses and methods for error correction coding and data bus inversion for semiconductor memories
MICRON TECHNOLOGY INC0 citations62
US11205470B2Dec 21, 2021
Apparatuses and methods for providing main word line signal with dynamic well
MICRON TECHNOLOGY INC1 citations62
US11170841B2Nov 9, 2021
Apparatus with extended digit lines and methods for operating the same
MICRON TECHNOLOGY INC0 citations62
US11017834B2May 25, 2021
Refresh command management
MICRON TECHNOLOGY INC1 citations62
US12165695B2Dec 10, 2024
Apparatuses for sense amplifier voltage control
MICRON TECHNOLOGY INC0 citations52
HYNIX SEMICONDUCTOR INC
5 patentsUS7199043B2Apr 3, 2007
Method of forming copper wiring in semiconductor device
HYNIX SEMICONDUCTOR INC12 citations84
US7087524B2Aug 8, 2006
Method of forming copper wiring in semiconductor device
HYNIX SEMICONDUCTOR INC16 citations84
US7056801B2Jun 6, 2006
Radio frequency integrated circuit, and method for manufacturing the same
HYNIX SEMICONDUCTOR INC8 citations73
US6998321B2Feb 14, 2006
Method for forming inductor in semiconductor device
HYNIX SEMICONDUCTOR INC4 citations63
US7128946B2Oct 31, 2006
Plate for forming metal wires and method of forming metal wires using the same
HYNIX SEMICONDUCTOR INC0 citations42
HYUNDAI ELECTRONICS IND
3 patentsUS5953622ASep 14, 1999
Method for fabricating semiconductor wafers
HYUNDAI ELECTRONICS IND205 citations98
US5888910AMar 30, 1999
Method for forming interlayer insulating film of semiconductor devices
HYUNDAI ELECTRONICS IND16 citations74
US5804515ASep 8, 1998
Method for forming contact holes of semiconductor device
HYUNDAI ELECTRONICS IND5 citations63