Inventor

LEE SEOKHYUN

KR74 patents

⚠️ This page may combine multiple inventors who share the name “LEE SEOKHYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE SEOKHYUN

SAMSUNG ELECTRONICS CO LTD

Semiconductor package and method of fabricating the same

Semiconductor package, package-on-package device, and method of fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Redistribution substrate, method of fabricating the same, and semiconductor package including the same

Methods of fabricating fan-out wafer level packages and packages formed by the methods

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package including redistribution substrate

Semiconductor package device

Semiconductor packages

Semiconductor package

Semiconductor packages

Semiconductor package with redistribution substrate having embedded passive device

Semiconductor package and method of fabricating the same

Display module package

Redistribution substrate, method of manufacturing the same, and semiconductor package including the same

Semiconductor package and method of fabricating the same

Semiconductor package, package-on-package device, and method of fabricating the same

Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same

Semiconductor package

Redistribution substrate having redistribution pattern including via seed patterns covering bottom surface and sidewall surface of wiring conductive patterns and semiconductor package including the same

Semiconductor package and method of manufacturing the same

Semiconductor package

Method of fabricating semiconductor package

Method of fabricating semiconductor package

Semiconductor device having a peripheral-region defect detection structure

Semiconductor package

Apparatus for stacked semiconductor chips

Semiconductor package and method of manufacturing the same

Semiconductor package

Semiconductor package including outer conductive plate

Semiconductor package

Semiconductor package device

Semiconductor package with multiple redistribution substrates

Semiconductor package and method of fabricating the same

Display module package

Semiconductor package

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package and method of manufacturing the same

Method of manufacturing redistribution substrate

Semiconductor package

Semiconductor package with multiple redistribution substrates

Method of manufacturing fan-out wafer level package

Semiconductor package and method of fabricating the same

Semiconductor package

Redistribution substrate, method of fabricating the same, and semiconductor package including the same

LG DISPLAY CO LTD

Electro-luminescent display device with improved contact structure

JANG JAEGWON

Semiconductor package and method of manufacturing the same