Inventor

WOJTCZAK WILLIAM A

US46 patents

⚠️ This page may combine multiple inventors who share the name “WOJTCZAK WILLIAM A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WOJTCZAK WILLIAM A

ADVANCED TECH MATERIALS

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

pH buffered compositions useful for cleaning residue from semiconductor substrates

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

Polishing slurries for copper and associated materials

Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures

Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent

Boric acid containing compositions for stripping residues from semiconductor substrates

Aqueous ammonium fluoride and amine containing compositions for cleaning inorganic residues on semiconductor substrates

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

Polishing slurries for copper and associated materials

Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent

Ammonium borate containing compositions for stripping residues from semiconductor substrates

Formulations including a 1, 3-dicarbonyl compound chelating agent for stripping residues from semiconductor substrates

Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures

Post plasma ashing wafer cleaning formulation

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

Polishing slurries for copper and associated materials

Boric acid containing compositions for stripping residues from semiconductor substrates

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates

Boric acid containing compositions for stripping residues from semiconductor substrates

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

FUJIFILM ELECTRONIC MAT USA INC

Cleaning formulation for removing residues on surfaces

Cleaning formulation for removing residues on surfaces

Cleaning formulation for removing residues on surfaces

Etching composition

Cleaning formulation for removing residues on surfaces

Cleaning formulation for removing residues on surfaces

Stripping compositions for removing photoresists from semiconductor substrates

Stripping compositions for removing photoresists from semiconductor substrates

Surface treatment compositions and methods

Surface treatment compositions and articles containing same

Surface treatment methods and compositions therefor

Cleaning formulation for removing residues on surfaces

Cleaning formulation for removing residues on surfaces

Methods of using surface treatment compositions

Cleaning formulation for removing residues on surfaces

Cleaning formulation for removing residues on surfaces

Stripping compositions for removing photoresists from semiconductor substrates

Stripping compositions for removing photoresists from semiconductor substrates

SACHEM INC

Cleaning solutions and etchants and methods for using same

Selective silicon etch process

ADVANCED TECHNOLOGIES MATERIAL

Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures

TAKAHASHI TOMONORI

Etching composition

FUJIFILM ELECTRONIC MATERIALS

Passivation composition and process

FUJIFILM CORP

Etching composition

WOJTCZAK WILLIAM A

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate