Inventor
CHOI DAE-YOUNG
KR25 patents
⚠️ This page may combine multiple inventors who share the name “CHOI DAE-YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LG INNOTEK CO LTD
11 patentsUS11723153B2Aug 8, 2023
Printed circuit board and method of fabricating the same
LG INNOTEK CO LTD1 citations72
US12232273B2Feb 18, 2025
Printed circuit board and method of fabricating the same
LG INNOTEK CO LTD0 citations62
US11297720B2Apr 5, 2022
Printed circuit board and method of fabricating the same
LG INNOTEK CO LTD0 citations62
US11019731B2May 25, 2021
Printed circuit board and method of fabricating the same
LG INNOTEK CO LTD0 citations62
US9686860B2Jun 20, 2017
Printed circuit board and method of fabricating the same
LG INNOTEK CO LTD1 citations62
US11889634B2Jan 30, 2024
Printed circuit board and method of manufacturing the same
LG INNOTEK CO LTD0 citations61
US10912202B2Feb 2, 2021
Method of manufacturing printed circuit board
LG INNOTEK CO LTD0 citations61
US10798827B2Oct 6, 2020
Printed circuit board and method of fabricating the same
LG INNOTEK CO LTD0 citations51
US10531569B2Jan 7, 2020
Printed circuit board and method of fabricating the same
LG INNOTEK CO LTD0 citations51
US9913383B2Mar 6, 2018
Printed circuit board and method of fabricating the same
LG INNOTEK CO LTD0 citations51
US9820378B2Nov 14, 2017
Printed circuit board and method of manufacturing the same
LG INNOTEK CO LTD0 citations50
SAMSUNG ELECTRONICS CO LTD
4 patentsUS8759967B2Jun 24, 2014
Semiconductor package and package on package having the same
SAMSUNG ELECTRONICS CO LTD4 citations72
US9190401B2Nov 17, 2015
Stacked semiconductor packages
SAMSUNG ELECTRONICS CO LTD3 citations62
US9111926B2Aug 18, 2015
Semiconductor package and package on package having the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US8970025B2Mar 3, 2015
Stacked packages having through hole vias
SAMSUNG ELECTRONICS CO LTD2 citations62