Inventor

CHONG CHIN HUI

SG92 patents

⚠️ This page may combine multiple inventors who share the name “CHONG CHIN HUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHONG CHIN HUI

MICRON TECHNOLOGY INC

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Metal core foldover package structures

Slanted vias for electrical circuits on circuit boards and other substrates

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Stacked microelectronic devices

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Stacked microelectronic devices

Through stack bridge bonding devices and associated methods

Slanted vias for electrical circuits on circuit boards and other substrates

Lead frame-based semiconductor device packages incorporating at least one land grid array package

Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods

Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer

Build-up package for integrated circuit devices, and methods of making same

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Build-up package for integrated circuit devices, and methods of making same

Build-up package for integrated circuit devices, and methods of making same

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates

Methods of making metal core foldover package structures

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Nested semiconductor assemblies and methods for making the same

Surface mount device bonded to an inner layer of a multi-layer substrate

Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the same

Semiconductor assemblies with systems and methods for managing high die stack structures

CORISIS DAVID J

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Methods of forming stacked semiconductor devices with a leadframe and associated assemblies

Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates

Electronic device assemblies including conductive vias having two or more conductive elements

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Stacked packaged integrated circuit devices

LEE CHOON KUAN

Packaged microelectronic devices and associated systems

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Land grid array semiconductor device packages

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

YE SENG KIM DALSON

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Method for manufacturing microelectronic devices

CHONG CHIN HUI

Method of manufacturing an interposer

Semiconductor assemblies with multi-level substrates and associated methods of manufacturing

MICRON TECHNOLOGIES INC

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

NG HONG WAN

Build-up package for integrated circuit devices, and methods of making same