Inventor

LEE CHOON KUAN

SG72 patents

⚠️ This page may combine multiple inventors who share the name “LEE CHOON KUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE CHOON KUAN

MICRON TECHNOLOGY INC

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Metal core foldover package structures

Slanted vias for electrical circuits on circuit boards and other substrates

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Stacked microelectronic devices

Microelectronic component assemblies having exposed contacts

Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Stacked microelectronic devices

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Slanted vias for electrical circuits on circuit boards and other substrates

Lead frame-based semiconductor device packages incorporating at least one land grid array package

Build-up package for integrated circuit devices, and methods of making same

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks

Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods

Methods for designing carrier substrates with raised terminals

Build-up package for integrated circuit devices, and methods of making same

Build-up package for integrated circuit devices, and methods of making same

Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates

Methods of making metal core foldover package structures

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

CORISIS DAVID J

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Methods of forming stacked semiconductor devices with a leadframe and associated assemblies

Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates

Electronic device assemblies including conductive vias having two or more conductive elements

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Stacked packaged integrated circuit devices

LEE CHOON KUAN

Packaged microelectronic devices and associated systems

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Land grid array semiconductor device packages

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Semiconductor device packages including a semiconductor device and a redistribution element

LUA EDMUND KOON TIAN

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

NG HONG WAN

Build-up package for integrated circuit devices, and methods of making same

Build-up package for integrated circuit devices, and methods of making same

MICRON TECHNOLOGIES INC

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

CHONG CHIN HUI

Method of manufacturing an interposer

YE SENG KIM DALSON

Method for manufacturing microelectronic devices