Inventor · disambiguated record
Takeshi Hosomi
Also filed as: HOSOMI TAKESHI
17 granted patents·7 pending applications·217 citations·filing 1989–2022
93Inventor score
Top patents by PatentIndex Score
24 records- 0185US7655871B2Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring boardSUMITOMO BAKELITE CO·Filed 2005·Granted Feb 2, 2010·8 cites·12 claims
- 0283US6483195B1Transfer bump street, semiconductor flip chip and method of producing sameSUMITOMO BAKELITE CO·Filed 2000·Granted Nov 19, 2002·31 cites·13 claims
- 0382US8044505B2Prepreg, method for manufacturing prepreg, substrate, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2006·Granted Oct 25, 2011·6 cites·27 claims
- 0476US5806177AProcess for producing multilayer printed circuit boardSUMITOMO BAKELITE CO·Filed 1996·Granted Sep 15, 1998·44 cites·9 claims
- 0571US8110444B2Prepreg, method for manufacturing prepreg, substrate, and semiconductor deviceHOSOMI TAKESHI·Filed 2010·Granted Feb 7, 2012·2 cites·7 claims
- 0669US5854325APhotosensitive adhesive composition for additive platingSUMITOMO BAKELITE CO·Filed 1997·Granted Dec 29, 1998·30 cites·23 claims
- 0769US5726219AResin composition and printed circuit board using the sameSUMITOMO BAKELITE CO·Filed 1997·Granted Mar 10, 1998·40 cites·17 claims
- 0862US9693462B2Printed circuit boardMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 27, 2017·1 cites·7 claims
- 0961US7368497B2Resin composition, prepreg, laminate, and semiconductor packageSUMITOMO BAKELITE CO·Filed 2004·Granted May 6, 2008·5 cites·17 claims
- 1056US5756190AUndercoating agent for multilayer printed circuit boardSUMITOMO BAKELITE CO·Filed 1996·Granted May 26, 1998·23 cites·13 claims
- 1156US2011256367A1Prepreg, method for manufacturing prepreg, substrate, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2011·Application pending·0 cites
- 1255US6768197B2Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2000·Granted Jul 27, 2004·9 cites·36 claims
- 1354US8629556B2Semiconductor deviceSUGINO MITSUO·Filed 2007·Granted Jan 14, 2014·1 cites·14 claims
- 1454US2009126974A1Manufacturing Process for a Prepreg with a Carrier, Prepreg with a Carrier, Manufacturing Process for a Thin Double-Sided Plate, Thin Double-Sided Plate and Manufacturing Process for a Multilayer-Printed Circuit BoardYUASA MAROSHI·Filed 2006·Application pending·0 cites
- 1553US2011120630A1Manufacturing process for a prepreg with a carrier, prepreg with a carrier, manufacturing process for a thin double-sided plate, thin double-sided plate and manufacturing process for a multilayer-printed circuit boardSUMITOMO BAKELITE CO·Filed 2011·Application pending·0 cites
- 1650US5976699AInsulating adhesive for multilayer printed circuit boardSUMITOMO BAKELITE CO·Filed 1996·Granted Nov 2, 1999·16 cites·20 claims
- 1748US2024324159A1High frequency diffusion sheetSUMITOMO BAKELITE CO·Filed 2022·Application pending·0 cites
- 1848US2015239197A1Article and laminateSUMITOMO BAKELITE CO·Filed 2013·Application pending·0 cites
- 1945US2009039487A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2008·Application pending·0 cites
- 2044US11348849B2Semiconductor apparatus and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted May 31, 2022·0 cites·15 claims
- 2144US9711460B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 18, 2017·0 cites·5 claims
- 2241US7759794B2Semiconductor deviceSUMITOMO BAKELITE CO·Filed 2006·Granted Jul 20, 2010·0 cites·11 claims
- 2334US2009166060A1Insulating Resin Layer, Insulating Resin Layer With Carrier And Multiple-Layered Printed Wiring BoardONOZUKA IJI·Filed 2006·Application pending·0 cites
- 2430US5110988ANonlinear optical materialSUMITOMO BAKELITE CO·Filed 1989·Granted May 5, 1992·1 cites·2 claims
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