Inventor

BLISH II RICHARD C

US38 patents

⚠️ This page may combine multiple inventors who share the name “BLISH II RICHARD C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BLISH II RICHARD C

ADVANCED MICRO DEVICES INC

Distributed voltage converter apparatus and method for high power microprocessor with array connections

Via configuration with decreased pitch and/or increased routing space

Method of making flip chip packages

Counterflow microchannel cooler for integrated circuits

Integrated circuit package and method

Method and apparatus for determining the robustness of memory cells to alpha-particle/cosmic ray induced soft errors

Apparatus and method to improve electromigration performance by use of amorphous barrier layer

Method to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pellets

Electrophoretic coating methodology to improve internal package delamination and wire bond reliability

Method and system for selectively disconnecting a redundant power distribution network to indentify a site of a short

System for marking electrophoretic dies while reducing damage due to electrostatic discharge

Neutron detecting device

Flip chip packages

Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor

Methods and systems for recovering data in a nonvolatile memory array

Prevention of counterfeit markings on semiconductor devices

Apparatus for metal stack thermal management in semiconductor devices

Method and apparatus for determining the robustness of memory cells to alpha-particle/cosmic ray induced soft errors

Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts

Encapsulation method using non-homogeneous molding compound pellets

Method and system for detecting faults utilizing an AC power supply

High pressure water stream to separate a multi-layer integrated circuit device and package

Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability

Apparatus for improving image depth resolution in a magnetic field imaging apparatus

Direct access to random redundant logic gates by using multiple short addresses

Method to improve testing speed of memory

Method and system for removing conductive lines during deprocessing

Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts

Apparatus for reducing warping of plastic packages

Prevention of parametic or functional changes to silicon semiconductor device properties during x-ray inspection

Structure for minimizing hot spots in SOI device

Method and system for determining the location of an open circuit in a semiconductor device using power modulation

Thermal interface material and semiconductor component including the thermal interface material

Method and apparatus for measuring effects of packaging stresses of common IC electrical performance parameters at wafer sort

INTEL CORP

Quad flat package heat slug composition

Integrated circuit package for surface mount technology

Quad flat package heat slug composition

SIGNETICS CORP

Etchants for glass films on metal substrates