Inventor

HORIKAWA YASUYOSHI

JP29 patents

⚠️ This page may combine multiple inventors who share the name “HORIKAWA YASUYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HORIKAWA YASUYOSHI

SHINKO ELECTRIC IND CO

Method of manufacturing an electronic parts packaging structure

Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device

Substrate for carrying a semiconductor chip and a manufacturing method thereof

Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device

Process for manufacturing a wiring board

Wiring substrate and manufacturing method thereof

Encapsulated electronic part packaging structure

Method of manufacturing electronic part packaging structure

Capacitor device and method of manufacturing the same

Wiring substrate, light emitting device, and manufacturing method of wiring substrate

Wiring board and light emitting device

Semiconductor device substrate, semiconductor device, and manufacturing method thereof

Capacitor device and semiconductor device having the same, and capacitor device manufacturing method

Semiconductor device substrate, semiconductor device, and manufacturing method thereof

Wiring substrate

Method of manufacturing wiring substrate

Inductor and method of manufacturing same

Optical sensor

Wiring substrate, manufacturing method therefor, and semiconductor package

Wiring substrate and light emitting device

Capacitor and method of producing same

Inductor device and method of manufacturing the same

Folded substrate for stacked integrated circuit devices

Method of manufacturing an inductor

Inductor

Wiring substrate and semiconductor package

HORIKAWA YASUYOSHI

Socket and method of fabricating the same

Connecting terminal structure, socket and electronic package

Connecting terminal structure, manufacturing method of the same and socket