Process for manufacturing a wiring board

Abstract

A resin plate having wiring pattern recesses and via through holes is made. All of the surfaces of the resin plate including inner walls of the wiring pattern recesses and via through holes are coated with a metal film. An electro-plating is applied using the metal film as a power-supply layer to fill a plated metal into the wiring pattern recesses and via through holes. The metal film formed on the resin plate except for the inner walls of the wiring pattern recesses and via through holes is removed, so that wiring pattern and via are exposed on a surface the same as that of the resin plate.

What is claimed is:  
     
       1. A process for manufacturing a wiring board, said process comprising the steps of: 
       making a resin plate which has wiring pattern recesses with inner walls therein and via through holes using a pair of molds;  
       coating all of the surfaces of the resin plate including said inner walls of said wiring pattern recesses and said via through holes with a metal film;  
       electro-plating using said metal film as a power-supply layer over an entire surface of said metal film so as to fill a plated metal into said wiring pattern recesses and into said via through holes; and  
       polishing said electro-plated metal formed on said resin plate to remove the same except for said inner walls of said wiring pattern recesses and said via through holes, to yield a wiring pattern and vias which are exposed on a surface that is the same as that of said resin plate.  
     
     
       2. A process as set forth in  claim 1 , wherein said resin plate is made by a press-forming process using a pair of press-forming molds. 
     
     
       3. A process as set forth in  claim 1 , wherein said resin plate is made by an injection molding process using a pair of injection molds. 
     
     
       4. A process as set forth in  claim 1  further comprising the following step of: 
       forming pads as a part of said wiring pattern to which external connecting terminals are to be attached.  
     
     
       5. A process as set forth in  claim 1  further comprising the steps of: 
       using said wiring board as a core substrate;  
       forming a resin layer on said core substrate; and  
       forming a wiring pattern on said resin layer in such a manner that said wiring pattern is connected to said wiring pattern or to said vias of said core substrate.  
     
     
       6. A process for manufacturing a multi-layer wiring board, said process comprising: 
       (a) manufacturing a core substrate comprising the steps of:  
       making a resin plate having wiring pattern recesses with inner walls therein and having via through holes using a pair of molds;  
       coating all of the surfaces of the resin plate including said inner walls of said wiring pattern recesses and said via through holes with a metal film;  
       electro-plating using said metal film as a power-supply layer over an entire surface of said metal film to fill a plated metal into said wiring pattern recesses and into said via through holes; and  
       polishing said plated metal formed on said resin plate to remove the same except for the inner walls of said wiring pattern recesses and of said via through holes to yield a wiring pattern and vias which are exposed on a surface that is the same as that of said resin plate; and  
       (b) forming resin layers on respective surfaces of said core substrate so that said respective resin layers include wiring pattern recesses having inner walls thereof and include via through holes;  
       (c) coating all of the surfaces of said respective resin layers including said inner walls of said wiring pattern recesses and said via through holes with a metal film;  
       (d) electro-plating using said metal film as a power-supply layer over an entire surface of said metal film to fill a plated metal into said wiring pattern recesses and into said via through holes; and  
       (e) polishing said plated metal formed on each of said respective resin layers to remove the same except for the inner walls of said wiring pattern recesses and said via through holes to yield a wiring pattern and vias which are exposed at a surface which is the same as that of the respective resin layer.  
     
     
       7. A process as set forth in  claim 6 , wherein said resin plate is made by a press-forming process using a press-forming mold. 
     
     
       8. A process as set forth in  claim 6 , wherein said resin plate is made by a injection molding process using an injection mold. 
     
     
       9. A process for manufacturing a wiring board comprising the steps of: 
       (a) preparing a laminated body comprising at least one resin layer and at least one wiring pattern on said resin layer;  
       (b) forming said resin layer with wiring pattern recesses having inner walls and with via through holes using a mold;  
       (c) coating all of the surfaces of the resin layer including said inner walls of said wiring pattern recesses and said via through holes with a metal film;  
       (d) electro-plating using said metal film as a power supply layer over an entire surface of said metal film so as to fill a plated metal into said wiring pattern recesses and said via through holes; and  
       (e) polishing said plated metal formed on said resin layer to remove the same except for the inner walls of said wiring pattern recesses and said via through holes to yield a wiring pattern and vias, so that wiring pattern and said vias are exposed on a surface which is the same as the surface that of said resin layer.  
     
     
       10. A process as set forth in  claim 9 , wherein said resin layer is formed by press-forming process using a press-forming mold. 
     
     
       11. A process as set forth in  claim 9 , wherein said resin layer is formed injection molding process using an injection mold. 
     
     
       12. A process for manufacturing a multi-layer wiring board comprising the seps of: 
       (a) preparing a wiring board which is made in accordance with the steps as defined in  claim 9 ;  
       (b) forming a second resin layer with wiring pattern recesses and with via through holes using a mold on said wiring board, said wiring pattern recesses having inner walls;  
       (c) coating all of the surfaces of the second resin layer including said inner walls of said wiring pattern recesses and said via through holes with a metal film;  
       (d) electro-plating using said metal film as a power supply layer over an entire surface of said metal film so as to fill a plated metal into said wiring pattern recesses and said via through holes; and  
       (e) polishing said plated metal formed on said second resin layer to remove the same except for the inner walls of said wiring pattern recesses and said via through holes to yield a wiring pattern and vias, so that said wiring pattern and said vies are exposed on a surface that is the same as that of said second resin layer.  
     
     
       13. A process as set forth in  claim 12  further comprising the following steps of: 
       repeating said steps (b) to (e) to obtain a multi-layer wiring board comprising a an even further or subsequent resin layer(s) formed on the resin lever.  
     
     
       14. A process for manufacturing a wiring board, said process comprising the steps of: 
       molding a resin plate to form wiring pattern recesses and via through holes in said resin plate, said wiring pattern recesses having inner walls;  
       coating all of the surfaces of the resin plate including said inner walls of said wiring pattern recesses and said via through holes with a metal film;  
       electro-plating using said metal film as a power supply layer over an entire surface of said metal film so as to fill a plated metal into said wiring pattern recesses and said via through holes; and  
       polishing said plated metal formed on said resin plate to remove the same except for the inner walls of said wiring pattern recesses and said via through holes, to yield a wiring pattern and vias which are exposed on a surface that is the same as that of said resin plate.