Inventor

ROKUGAWA AKIO

JP57 patents

⚠️ This page may combine multiple inventors who share the name “ROKUGAWA AKIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ROKUGAWA AKIO

SHINKO ELECTRIC IND CO

Method of making multilayered substrate for semiconductor device

Multilayered substrate for semiconductor device

Semiconductor device package and method of production and semiconductor device of same

Wiring substrate and semiconductor device

Semiconductor device package and method of production and semiconductor device of same

Method of production of semiconductor package

Semiconductor package, method of production of same, and semiconductor device

Method of fabricating substrate utilizing an electrophoretic deposition process

Semiconductor package, method of manufacturing the same, and semiconductor device

Production of multilayer circuit board

Build-up board package for semiconductor devices

Method of manufacturing wiring substrate to which semiconductor chip is mounted

Substrate fabrication method and substrate

Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereon

Process for manufacturing a wiring board

Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated

Semiconductor package, method of manufacturing the same, and semiconductor device

Wiring board

Wiring board, semiconductor device, and method of manufacturing wiring board

Semiconductor package including a metal plate, semiconductor chip, and wiring structure, semiconductor apparatus and method for manufacturing semiconductor package

Semiconductor package, semiconductor package manufacturing method and semiconductor device

Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate

Semiconductor package, method of production of same, and semiconductor device

Multilayered circuit substrate, semiconductor device and method of producing same

Thin-film capacitor device, mounting module for the same, and method for fabricating the same

Wiring substrate and semiconductor package

Wiring board, electronic component device, and method for manufacturing those

Wiring board and semiconductor device

Wiring substrate and method of manufacturing the same

Wiring board

Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element

Multilayered substrate for semiconductor device and method of manufacturing same

Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board

Wiring substrate, semiconductor device, and method of manufacturing wiring substrate

Wiring substrate and semiconductor device

Wiring substrate and semiconductor device

Wiring board, semiconductor device, and method of manufacturing wiring board

Wiring board, semiconductor device, and method for manufacturing wiring board

Multilayered circuit substrate, semiconductor device and method of producing same

Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device

Wiring board and method of manufacturing the same

Wiring board and method of manufacturing the same

Wiring substrate and semiconductor device

Semiconductor device substrate, semiconductor device, and manufacturing method thereof

Semiconductor device substrate, semiconductor device, and manufacturing method thereof

Method of manufacturing semiconductor package

SHIMIZU NORIYOSHI

Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch

Semiconductor package manufacturing method and semiconductor package

DENKI KAGAKU KOGYO KK

Charged particle emission source structure

KISHII SADAHIRO

Semiconductor device and its manufacture method