Inventor

CHOI HYEONG SEOK

KR40 patents

⚠️ This page may combine multiple inventors who share the name “CHOI HYEONG SEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOI HYEONG SEOK

SAMSUNG ELECTRONICS CO LTD

Magnetic recording/reproducing apparatus

Tape guide device for magnetic recording/reproducing apparatus

Reel braking apparatus for a tape recorder

Head drum apparatus

Reel clutch of a tape recorder

Tape deck mechanism with main cam gear moving sub-deck, pole base loading unit, brake unit and main sliding memeber

Tape loading device for a tape recorder

Stator assembly of drum motor, and head drum assembly of magnetic recording/reproducing apparatus

Ground device of head drum apparatus

Method of locking tape cassette housing of tape recorder

Locking device for tape cassette housing of tape recorder

Moving deck plate for camcorder

Tape-end sensor and a magnetic recording and reproducing apparatus having the same

Cassette tape ejecting apparatus, and magnetic recording/reproducing apparatus having the same

Magnetic recording and reproducing apparatus and driving method thereof

Reel brake device having simple structure and a magnetic recording/reproducing apparatus having the same

Reel cover of magnetic recording/reproducing apparatus, and a method of manufacturing thereof

Magnetic tape guiding device for use with a tape transport system of a tape recorder and method for using the same

Reel clutch of a tape recorder

Magnetic recording and reproducing apparatus and method for braking a reel assembly

Oil spattering prevention apparatus for tape recorder

Pole base assembly for magnetic recording/reproducing apparatus

SK HYNIX INC

Method of manufacturing wafer level package and wafer level package manufactured thereby

Manufacturing methods semiconductor packages including through mold connectors

Semiconductor packages including through mold ball connectors and methods of manufacturing the same

Manufacturing methods semiconductor packages including through mold connectors

Semiconductor chip including through electrode, and semiconductor package including the same

Stacked semiconductor package and method for manufacturing the same

Semiconductor chip including through electrode, and semiconductor package including the same

Methods of fabricating semiconductor packages including circuit patterns

Semiconductor packages with socket plug interconnection structures

Semiconductor devices and packages having through electrodes

Conductive bump, semiconductor chip and stacked semiconductor package using the same

Stacked semiconductor package and method for manufacturing the same

Conductive bump, semiconductor chip and stacked semiconductor package using the same

Semiconductor device including redistribution layer and method for fabricating the same

Wafer level packages and electronics system including the same

HYNIX SEMICONDUCTOR INC

Method for manufacturing stack package using through-electrodes

Multi-layer stacked wafer level semiconductor package module

PARK CHANG JUN

Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same